Power Electronics Assembly With Combined Liquid-Air Cooling
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Solution Overview
Problem
Existing power electronics devices in refrigeration systems face overheating issues during startup and shutdown due to insufficient liquid refrigerant circulation, necessitating expensive dedicated pumps for cooling, which is not an optimal solution.
Innovation Solution
A heat exchanger integrated with power electronics devices that utilizes liquid refrigerant from an HVAC system condenser to cool the devices, featuring fluid pathways and fins for thermal energy transfer, allowing phase change of refrigerant and natural convection heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid refrigerant from HVAC system condenser is used to cool power electronics devices, then cooling effectiveness is improved, but insufficient liquid circulation during startup and shutdown causes overheating
Solution Approach 1:
The patent combines liquid cooling and air cooling into a single hybrid heat exchanger assembly. The liquid refrigerant flows through internal channels to provide primary cooling, while external fins enable air convection for secondary cooling. This merging allows the system to maintain effective cooling during startup and shutdown when liquid circulation is insufficient, as the air cooling pathway remains active independently.
Solution Approach 2:
The heat exchanger assembly serves multiple cooling functions simultaneously: it acts as both a liquid-to-liquid heat exchanger (refrigerant to coolant) and a liquid-to-air heat exchanger (refrigerant to ambient air via fins). This multi-functionality ensures that cooling capability is maintained across all system operating conditions, including startup and shutdown when liquid flow is limited.
2Reliability
If a dedicated pump is provided to ensure liquid circulation during startup and shutdown, then overheating is prevented, but system cost and complexity increase
Solution Approach 1:
The patent merges the cooling function into the existing heat exchanger structure by adding external fins to enable air cooling, eliminating the need for a separate dedicated pump. The hybrid heat exchanger assembly provides both liquid and air cooling pathways within a single component, reducing system complexity while maintaining reliability during startup and shutdown.
Solution Approach 2:
The air cooling pathway enabled by external fins provides self-service cooling capability that does not depend on liquid pump operation. During startup and shutdown when the pump is inactive, the fins naturally dissipate heat through air convection, allowing the system to protect itself without requiring additional active components like a dedicated pump.
3Reliability
If hybrid liquid and air cooling is implemented, then cooling reliability during startup and shutdown is improved, but heat exchanger structure becomes more complex
Solution Approach 1:
The patent integrates liquid cooling channels and air cooling fins into a single unified heat exchanger assembly. The liquid channels are formed within the heat exchanger body, while fins extend from the external surfaces, creating a compact hybrid structure that provides both cooling modes without requiring separate components. This merging reduces overall system complexity despite adding multi-functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively cools power electronics devices during system startup and shutdown by ensuring consistent thermal management without the need for dedicated pumps, enhancing system efficiency and reducing costs.
Implementation Method 1
the heat exchanger configured to transfer thermal energy from the one or more power electronics devices into a flow of fluid passing through the one or more fluid pathways
Implementation Method 2
A plurality of fins extend from an outer surface of the heat exchanger body
Data Source
AI summary
A power electronics assembly includes one or more power electronics devices, and a heat exchanger to which the one or more power electronics devices are mounted. The heat exchanger includes a heat exchanger body, and one or more fluid pathways extending through the heat exchanger body, the heat exchanger configured to transfer thermal energy from the one or more power electronics devices into a flow of fluid passing through the one or more fluid pathways. A plurality of fins extend from an outer surface of the heat exchanger body. The flow of fluid is a flow of liquid refrigerant diverted from a condenser of a heating, ventilation, and air conditioning (HVAC) system.