Reinforced Thermal Conduction Panel for Water-Based Heat Dissipation
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Solution Overview
Problem
Existing heat dissipation systems for MIMO technology in antenna devices face limitations in thermal conductivity, size, and cost, particularly with aluminum alloy fins, and refrigerant systems face issues with pressure regulation and restricted refrigerant choices due to environmental regulations.
Innovation Solution
An active heat dissipation apparatus using a thermal conduction panel body with a refrigerant flow space and reinforcement portions to enhance heat transfer, allowing the use of lower thermal conductivity materials like SUS and water as refrigerants, while maintaining effective heat dissipation performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If aluminum alloy heat dissipation fins are used, then thermal conductivity is improved, but manufacturing cost increases and weight increases
Solution Approach 1:
The patent replaces expensive aluminum alloy with cheaper SUS (stainless steel) material for the heat dissipation plate, achieving cost reduction while maintaining adequate heat dissipation performance through the phase change mechanism
Solution Approach 2:
The patent changes the material parameter from aluminum alloy to SUS, and utilizes phase change of refrigerant to compensate for the lower thermal conductivity, achieving cost reduction without sacrificing heat dissipation effectiveness
2Temperature
If aluminum alloy heat dissipation fins are used, then thermal conductivity is improved, but device weight increases
Solution Approach 1:
The patent uses SUS material instead of aluminum alloy, reducing weight while achieving comparable heat dissipation through the phase change refrigerant system
3Temperature
If refrigerant flow space is added to improve heat dissipation, then heat transfer performance is improved, but device complexity increases
Solution Approach 1:
The patent combines the heat dissipation plate and refrigerant container into a single integrated structure, where the refrigerant flow space is formed within the plate itself, reducing overall device complexity while maintaining effective heat dissipation
Solution Approach 2:
The heat dissipation plate simultaneously serves as both a thermal conduction component and a refrigerant containment structure, eliminating the need for separate components and simplifying the overall system
4Ease of manufacture
If water is used as refrigerant to reduce cost and improve environmental compliance, then manufacturing cost is reduced and environmental compliance is improved, but pressure regulation becomes more difficult
Solution Approach 1:
The patent creates localized vaporization and condensation zones within the refrigerant flow space, with vaporization occurring near the heat source and condensation at the periphery, enabling effective heat dissipation with water as refrigerant despite its pressure regulation challenges
Solution Approach 2:
The patent utilizes the phase change of water from liquid to vapor and back, leveraging the latent heat of vaporization for efficient heat absorption and the condensation process for heat release, effectively managing water's pressure characteristics through controlled phase transitions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves heat dissipation performance, reduces manufacturing costs, and complies with environmental regulations by using water as a refrigerant, achieving comparable or better results than traditional aluminum-based systems.
Implementation Method 1
capable of improving heat dissipation performance by actively transferring heat, which is generated from a heat generation device (e.g., an electronic device), by means of a phase change of a refrigerant
Implementation Method 2
an active heat dissipation apparatus capable of improving heat dissipation performance by actively transferring heat
Data Source
AI summary
The present disclosure relates to an active heat dissipation apparatus including a thermal conduction panel body having a refrigerant flow space in which a refrigerant is stored and flows, the refrigerant flow space being formed in the thermal conduction panel body by bending or joining at least one metal panel member, in which the refrigerant flow space includes a first refrigerant flow path positioned adjacent to a press-fitting portion provided in a rear surface portion of a heat dissipation housing main body that is a heat dissipation target, the first refrigerant flow path having a vaporization zone in which the refrigerant changes from a liquid phase to a gaseous phase, and a plurality of strength reinforcement portions formed in a condensation zone excluding the vaporization zone of the first refrigerant flow path and configured to reinforce rigidity of the thermal conduction panel body configured to define one side surface and the other side surface of the refrigerant flow space, thereby significantly improving heat dissipation performance.