Substrate Cooling Layout to Limit Thermal Coupling Between Components
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Solution Overview
Problem
Components such as electronic circuitry and photonic components generate unwanted heat during use, requiring effective cooling solutions to maintain stable operating temperatures and improve efficiency, especially in consumer electronic devices.
Innovation Solution
An apparatus comprising a substrate with components mounted on one surface, heat transfer means extending through the substrate, and a heat pipe on the opposing surface, along with temperature control means like thermoelectric coolers, to efficiently manage heat transfer and maintain component temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If heat transfer means extend through the substrate to conduct heat away from components, then heat removal efficiency is improved, but thermal coupling between components increases
Solution Approach 1:
The heat transfer means are divided into multiple discrete thermal vias rather than a continuous thermal path. These segmented thermal vias are strategically positioned to conduct heat away from individual components without creating extensive thermal coupling between adjacent components on the substrate.
Solution Approach 2:
The substrate is designed with non-uniform thermal properties - high thermal conductivity regions (thermal vias) are localized directly beneath heat-generating components to maximize heat removal, while the bulk substrate maintains lower thermal conductivity to minimize lateral heat spread and thermal coupling between components.
2Reliability
If temperature control means are added to maintain stable operating temperatures, then component reliability is improved, but power consumption increases
Solution Approach 1:
The passive heat transfer means (thermal vias and substrate design) automatically manage heat removal from components without requiring active temperature control. The thermal design itself provides the temperature stabilization function, eliminating or reducing the need for powered temperature control means and their associated power consumption.
Solution Approach 2:
The temperature control function is extracted from active powered components and embedded into the passive thermal design of the substrate and heat transfer means. This transfers the temperature stabilization responsibility to the thermal management structure itself, reducing reliance on powered temperature control means.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces heat transfer between components, allows for efficient heat removal, and minimizes power consumption by the temperature control means, thereby enhancing the performance and reliability of electronic devices.
Implementation Method 1
a plurality of heat transfer means extending through the substrate from the first surface to the second surface; at least part of a heat pipe provided on the second surface of the substrate and thermally connected to the plurality of heat transfer means
Implementation Method 2
at least part of a heat pipe provided on the second surface of the substrate and thermally connected to the plurality of heat transfer means
Implementation Method 3
The at least one temperature control means may comprise at least one thermoelectric cooler and/or at least one or more heater within the second component
Data Source
AI summary
Examples of the disclosure relate to apparatus for cooling components such as electronic circuitry components and photonic components. A first component and a second component are provided on the same surface of a substrate. At least one temperature control means, such as a thermoelectric cooler. is configured to control the temperature of at least one of the components. The apparatus also comprises a plurality of heat transfer means that extend through the substrate from the first surface to the second surface. The plurality of heat transfer means enable heat to be transferred from the components to a heat pipe provided on the second surface of the substrate. This enables heat to be transferred through the substrate and away from the components and so can reduce the amount of heat that spreads laterally across the substrate. This allows for efficient removal of heat from the components and reduces heat transfer between the components.