Flexible Heat Exchange Device With Passive Heat Pipe Transfer
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Solution Overview
Problem
Existing cooling technologies for electronic systems, such as air-cooling and liquid-cooling, face limitations in packaging density, efficiency, and reliability due to space requirements and potential leaks or pump failures.
Innovation Solution
A flexible heat exchange device with an evaporator, condenser, and a flexible heat flow element that connects the evaporator and condenser, allowing for a passive, closed-loop heat transfer system that integrates both thermal and mechanical connections to efficiently dissipate heat without the need for fans or pumps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If air-cooling solutions with fans are used, then the system is relatively low cost, but the packaging density is limited due to space needed for air flow and the efficiency is lower
Solution Approach 1:
The patent combines the thermal management function with the structural support function by integrating the heat exchanger directly into the device chassis. The heat exchanger serves dual purposes: dissipating heat from electronic components and providing structural support for mounting components, thereby eliminating the need for separate air flow channels and improving packaging density while maintaining cost-effectiveness
Solution Approach 2:
The heat exchanger is designed to perform multiple functions simultaneously: it acts as a thermal management component for heat dissipation, a structural element for mounting electronic components, and a space-efficient solution that improves packaging density. This multi-functionality resolves the contradiction between low cost and high packaging density
2Temperature
If liquid-cooling with cold plates is used, then cooling efficiency is higher, but the system requires a pumped liquid loop with numerous fluid connections which poses a risk of leaking and pump failure
Solution Approach 1:
The patent extracts the pump and fluid circulation system from the thermal management solution, replacing them with a passive heat pipe-based heat exchanger. This eliminates the risk of pump failure and fluid leakage while maintaining high cooling efficiency through phase-change heat transfer mechanisms inherent to heat pipe technology
Solution Approach 2:
The heat exchanger uses passive heat pipe technology that self-regulates heat transfer without requiring external power or active pumping. The phase-change mechanism automatically drives heat from hot to cold regions, providing reliable cooling without pumps or fluid connections that could leak or fail
3Temperature
If liquid-cooling with cold plates is used, then cooling efficiency is higher, but space is taken up which can limit the density of the system
Solution Approach 1:
The heat exchanger merges the thermal management function with the structural support function, allowing it to serve as both a cooling component and a mounting structure for electronic components. This integration eliminates the need for separate cooling channels and structural elements, improving system density while maintaining high cooling efficiency
Solution Approach 2:
The heat exchanger is designed as a multi-functional component that provides both thermal management and structural support. By serving multiple purposes simultaneously, it maximizes the use of available space and improves system density without compromising cooling performance
4Adaptability or versatility
If a flexible heat flow element is used to connect evaporator and condenser, then customizable form factors and thermal interfaces are improved, but the device complexity increases
Solution Approach 1:
The patent uses a flexible heat flow element that can dynamically adapt to different spatial configurations and thermal interface requirements. This flexibility allows the heat exchanger to be customized for various form factors and mounting positions without requiring multiple rigid components, thereby improving adaptability while actually simplifying the overall device design through a single versatile element
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system provides improved thermal interfaces, higher power density, reduced failure modes, and increased reliability by enabling customizable form factors and efficient heat transfer without the need for external power or fluid connections.
Implementation Method 1
The heat exchange device can include a set of closed loop fluid channels containing a mixture of liquid slugs and vapor bubbles, which transfers heat from the evaporator, through the flexible ribbon section
Implementation Method 2
a flexible heat exchange device with an evaporator, condenser, and a flexible heat flow element that connects the evaporator and condenser, allowing for a passive, closed-loop heat transfer system
Data Source
AI summary
A heat exchange device for an electromechanical system. The heat exchange device can include an evaporator, a condenser, and a flexible heat flow element (or “ribbon” section) that connects the evaporator and the condenser. The “ribbon” section can receive heat, from heat source associated with the electromechanical system, via the evaporator. The condenser can be coupled to a structural element that is part of a movable component of the electromechanical system. The condenser receives heat from the evaporator via the “ribbon” section. The condenser interfaces with an enclosure of the electromechanical system to provide both a thermal connection between the condenser element and the enclosure and a structural connection between the movable component and the enclosure, via the structural element.