Hybrid Server Cooling With Dual Fluid Loops and Heat Exchanger

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Solution Overview

Problem

Conventional cooling systems for servers in data centers are limited in heat removal capacity due to the extent of air conditioning available, which restricts server performance and efficiency.

Innovation Solution

A dual cooling system using a primary cooling fluid and a secondary cooling fluid, where the secondary cooling fluid is distinct from the primary cooling fluid, with heat transfer occurring between them via a heat exchanger to enhance heat removal from both primary and peripheral heat-generating devices.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If conventional air cooling systems are used, then the cooling system is simple and cost-effective, but the heat removal capacity is limited by air conditioning availability

Engineering Contradiction:
Improveheat removal capacityVSAvoidcooling system complexity
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The cooling system is segmented into two independent loops: a primary liquid cooling loop for heat-generating electronic devices and a secondary air cooling loop for peripheral devices. This segmentation allows each loop to be optimized for its specific cooling requirements, enabling high heat removal capacity from critical components while maintaining overall system manageability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A heat exchanger serves as an intermediary component that transfers heat from the primary cooling fluid to the secondary cooling fluid. This mediator enables thermal coupling between the two loops, allowing the liquid-cooled system to reject heat to the air-cooled system without direct fluid mixing, thus resolving the contradiction between high heat removal and system complexity.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Productivity

If higher performance server components are used, then server performance increases, but heat dissipation requirements increase beyond conventional cooling capacity

Engineering Contradiction:
Improveserver performanceVSAvoidheat dissipation capacity
Core Design Contradiction:
ProductivityVSTemperature

Solution Approach 1:

The system employs liquid hydraulics (primary cooling fluid circulation) for direct cooling of high-performance heat-generating components, providing superior heat transfer coefficients compared to air cooling. This enables the system to handle the increased heat dissipation requirements of high-performance server components while maintaining component temperatures within operational limits.

Inventive Principle:
Principle #29Pneumatics and hydraulics

3Loss of energy

If air cooling is used for all components, then the system is simple to implement, but heat-generating electronic devices cannot be cooled effectively

Engineering Contradiction:
Improvecooling efficiencyVSAvoidcooling system structure
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The cooling system applies local quality by providing liquid cooling specifically to heat-generating electronic devices that require high cooling efficiency, while using simpler air cooling for peripheral devices with lower thermal demands. This localized approach optimizes cooling efficiency for critical components without unnecessarily complicating the entire system.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for more effective heat management, improving server performance by increasing the heat removal capacity beyond conventional limits, thereby enhancing operational efficiency and reducing cooling system costs.

Implementation Method 1

passing a flow of the primary cooling fluid over the at least one heat-generating electronic device

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 2

passing a flow of the primary cooling fluid across a heat sink attached to the at least one heat-generating electronic device

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 3

transferring heat from the secondary cooling fluid to the primary cooling fluid

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Data Source

PatentUS20240237308A1Server with hybrid thermal management system
Publication Date: 2024.07.11 CARRIER CORP
  • US20240237308A1 patent drawing
  • US20240237308A1 patent drawing
  • US20240237308A1 patent drawing

AI summary

A method of cooling an assembly including at least one heat-generating electronic device and at least one peripheral heat-generating device includes cooling the at least one heat-generating electronic device with a primary cooling fluid and cooling the at least one heat-generating electronic device and the at least one peripheral heat-generating device with a secondary cooling fluid. The secondary cooling fluid is distinct from the primary cooling fluid.