Data center liquid conduction and carbon dioxide based cooling apparatus and method
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Solution Overview
Problem
Traditional cooling systems in data centers are inadequate for managing high heat loads and heat flux from high-density electronic devices, leading to thermal runaway conditions and inefficiencies in energy and water usage, with a need for more effective thermal management techniques beyond air cooling.
Innovation Solution
A liquid-cooled conduction cooling apparatus using a CO2 refrigerant system with a closed loop and modular, stacked heat exchangers, incorporating a Venturi tube for pressure reduction and a leak detection mechanism, along with thermo-electric materials to generate auxiliary power from temperature differentials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional air cooling methods are used, then device simplicity is maintained, but heat removal efficiency is insufficient for high power density devices
Solution Approach 1:
The patent transitions from air cooling to liquid cooling by introducing a coolant circulation system with pumps, heat exchangers, and fluid channels. The hydraulic cooling system uses liquid coolant flowing through channels in contact with electronic components to efficiently remove heat, resolving the contradiction between heat removal efficiency and system complexity.
2Temperature
If liquid coolant is used for direct cooling, then heat removal efficiency improves, but risk of liquid leakage and electronic component damage increases
Solution Approach 1:
The patent introduces an intermediary coolant substance that transfers heat from electronic components through a controlled circulation system. The coolant acts as a mediator between the heat source (electronic devices) and heat sink (cooling system), enabling efficient heat transfer while containing the liquid within sealed channels, thus reducing leakage risk to electronic components.
Solution Approach 2:
The patent employs sealed channels and enclosures to contain the liquid coolant, preventing direct contact with electronic components. These sealed structures act as protective barriers that maintain cooling effectiveness while eliminating the risk of liquid leakage damaging sensitive electronics.
3Productivity
If high-density electronic assemblies are used, then space utilization improves, but heat flux and thermal management difficulty increase
Solution Approach 1:
The patent implements a liquid cooling system with coolant channels directly integrated into high-density electronic assemblies. The liquid coolant flows through these channels, providing efficient heat removal from densely packed components that generate high heat flux, enabling space-efficient designs without compromising thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides efficient heat removal, reduces energy consumption, minimizes water usage, and leverages CO2 as a natural refrigerant with zero greenhouse gas emissions, enabling scalable and sustainable thermal management for high-density data center applications.
Implementation Method 1
a second heat exchanger for removing heat from the fluid reservoir. In a preferred embodiment, the second heat exchanger comprises an evaporator in a CO2 refrigerant system
Implementation Method 2
a pressure reducing unit comprising a pump associated with the flow duct and a tube configured for reducing the pressure of the fluid in the portion of the flow duct arranged in thermal communication with the device
Implementation Method 3
a first heat exchanger for exchanging heat with the device... at least a portion of the flow duct is arranged for thermal communication with the device
Data Source
AI summary
Embodiments disclosed include a heat exchange apparatus and method comprising, in an electronic device, a first heat exchanger for exchanging heat with the device wherein the heat exchanger comprises a flow duct for receiving a fluid, and at least a portion of the flow duct is arranged for thermal communication with the device. Preferred embodiments include a pressure reducing unit comprising a pump associated with the flow duct and a Venturi tube configured for reducing the pressure of the fluid in the portion of the flow duct arranged in thermal communication with the device and less than the pressure external to the duct. An embodiment includes a fluid reservoir, and a second heat exchanger for removing heat from the fluid reservoir wherein the second heat exchanger comprises an evaporator in a refrigerant system through which refrigerant is passed in a closed loop via an expansion valve from a gas cooler and back into a compressor.