Sealed Dual-Phase Evaporative Cooling for Server Rack Electronics
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Solution Overview
Problem
Immersion cooling methods for electronic components increase weight and require specialized mounts, making them unsuitable for deployment in standard server racks without modifications.
Innovation Solution
A sealed dual-phase evaporative cooling system that uses vapor produced by high-heat dissipating components to cool low-heat dissipating components, reducing weight and allowing deployment in server racks by utilizing a wicking structure to collect and condense vapor for reuse.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If immersion cooling is used to cool electronic components, then cooling effectiveness is improved, but device weight increases significantly
Solution Approach 1:
The patent utilizes phase transitions of coolant between liquid and vapor states to achieve efficient cooling. The coolant evaporates at the heat-generating component absorbing latent heat, then condenses on the condenser surface releasing heat to the surrounding air, providing effective cooling with minimal coolant quantity and reduced weight
Solution Approach 2:
The cooling system is segmented into distinct functional zones: an evaporative cooling zone with liquid coolant contact for high-heat components, and a vapor condensation zone for heat dissipation to the environment. This segmentation allows efficient heat transfer without requiring complete immersion of all components, reducing overall coolant volume and device weight
2Temperature
If immersion cooling is used to cool electronic components, then cooling effectiveness is improved, but device complexity increases due to specialized mounts and enclosures
Solution Approach 1:
The patent applies local quality by providing immersive liquid coolant cooling only to specific high-heat-generating components that require it, while other components are cooled by the vapor phase and condensation process. This localized approach eliminates the need for specialized mounts and complex enclosures required by full immersion cooling systems
Solution Approach 2:
The patent introduces vapor as an intermediary medium between the liquid coolant and the surrounding environment. The vapor carries heat from the evaporative zone to the condensation zone, enabling heat dissipation without requiring complex fluid circulation systems, pumps, or specialized enclosures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively cools low-heat dissipating components using vapor from high-heat dissipating components, reducing overall weight and enabling deployment in server racks without specialized modifications.
Implementation Method 1
the wicking structure collects liquid coolant from the condenser
Implementation Method 2
the one or more high-heat dissipating components evaporate liquid coolant from the wicking structure to generate vapor
Implementation Method 3
the vapor is utilized to cool the one or more low-heat dissipating components
Implementation Method 4
the wicking structure collects liquid coolant from the condenser
Data Source
AI summary
A sealed dual-phase evaporative cooling enclosure is disclosed. The sealed dual-phase evaporative cooling enclosure comprises one or more high-heat dissipating components, one or more low-heat dissipating components, a wicking structure; and a condenser, where the wicking structure is proximal to one or more high-heat dissipating components and the condenser, the wicking structure collects liquid coolant from the condenser, the one or more high-heat dissipating components evaporate liquid coolant from the wicking structure to generate vapor, and the vapor is utilized to cool the one or more low-heat dissipating components. A computer-implemented method and computer program product are also disclosed. A processor retrieves temperature data associated high-heat dissipating components. A processor retrieves associated with a wicking structure in the sealed dual-phase evaporative cooling enclosure. A processor adjusts the coolant flow to the condenser in the sealed dual-phase evaporative cooling enclosure based on the temperature data and the saturation data.