Vehicle Electronics Heat Dissipation With Thin Interface Layers
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Solution Overview
Problem
Existing heat dissipation designs are inadequate for high-computing-power modules, leading to performance degradation and reliability issues in vehicles.
Innovation Solution
A heat dissipation apparatus with a housing, heat-conducting material layer, and high-density heat dissipation fins, utilizing die casting and hybrid die casting techniques to ensure close attachment and increased heat exchange area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thick heat-conducting material layer is used, then heat conduction capability is improved, but attachment quality and heat transfer efficiency deteriorate
Solution Approach 1:
The patent optimizes the thickness parameter of the heat-conducting material layer to a specific range (0.1-0.5mm) to achieve the best balance between heat conduction capability and attachment quality. This parameter optimization resolves the contradiction by finding the optimal point where both requirements are satisfied simultaneously.
2Area of stationary object
If heat dissipation fin density is increased, then heat exchange area is improved, but manufacturing complexity increases
Solution Approach 1:
The patent specifies precise parameter ranges for fin density (pitch of 0.5-2mm, thickness of 0.1-0.5mm) to achieve high heat exchange area while controlling manufacturing complexity. By defining optimal parameter ranges, the patent makes the complex heat dissipation structure manufacturable.
Solution Approach 2:
The heat dissipation structure is segmented into multiple fins with uniform spacing, allowing standardized manufacturing processes. This segmentation enables complex heat exchange areas to be achieved through repeated modular units, reducing overall manufacturing complexity.
3Power
If computing power is increased, then processing capability is improved, but heat generation and dissipation difficulty worsen
Solution Approach 1:
The patent combines the heat-conducting material layer and heat dissipation fins into an integrated heat dissipation apparatus that works as a unified system. This merging allows efficient heat transfer from high-power computing components by providing both thermal conduction path and large heat exchange surface area simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation effectiveness by ensuring close attachment and increasing the heat exchange area, preventing heat transfer disruptions and improving overall thermal management.
Implementation Method 1
a heat-conducting material layer, located between the first housing portion and the to-be-cooled apparatus, and configured to conduct heat from the to-be-cooled apparatus to the first heat dissipation structure
Implementation Method 2
a first heat dissipation structure, fastened to a bottom portion of the second cavity, where the first heat dissipation structure includes a plurality of first heat dissipation fins
Implementation Method 3
a first heat dissipation structure, fastened to a bottom portion of the second cavity, where the first heat dissipation structure includes a plurality of first heat dissipation fins
Data Source
AI summary
A heat dissipation apparatus includes: a cover; a housing, including a first housing portion and a second housing portion, where the first housing portion and the second housing portion form a first cavity, the first cavity is used to accommodate a to-be-cooled apparatus, the to-be-cooled apparatus is fastened to a circuit board, the circuit board is fastened to the first housing portion by a spring screw, and the first housing portion includes a second cavity; a first heat dissipation structure, fastened to a bottom portion of the second cavity, where the first heat dissipation structure includes a plurality of first heat dissipation fins; and a heat-conducting material layer, located between the first housing portion and the to-be-cooled apparatus, and configured to conduct heat from the to-be-cooled apparatus to the first heat dissipation structure, where a thickness of the heat-conducting material layer is less than or equal to a third value.