Heat Dissipation Structure With Solid-State Phase-Change Filling
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Solution Overview
Problem
Conventional heat dissipation methods for electronic elements require liquid thermally conductive media, necessitating glue dispensing stations and complex processes, leading to high costs and reduced production efficiency due to stability and control requirements.
Innovation Solution
Employing a solid-state phase-change thermally conductive material that melts to a liquid state when activated, allowing manual or mechanical handling without glue dispensing stations, and integrating it with a heat dissipation cover to form a thermally conductive channel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If liquid thermally conductive medium is used, then heat conduction is improved, but device complexity and processing costs increase due to requirement of glue dispensing station
Solution Approach 1:
The patent changes the physical state parameter of the thermally conductive material from liquid to solid at room temperature. This allows the material to be handled and applied using simple manual or automated placement methods without requiring specialized glue dispensing equipment, while still providing effective heat conduction when melted during operation.
Solution Approach 2:
The patent utilizes phase transition of the thermally conductive material from solid state at room temperature to liquid state during operation. The material is applied in solid form without complex equipment, then transitions to liquid form during heat dissipation operation to fill gaps and establish thermal conduction channels between the electronic element and heat sink.
2Reliability
If liquid thermally conductive medium is used, then heat conduction is improved, but production efficiency decreases due to high process stability requirements
Solution Approach 1:
By changing the material from liquid to solid state at room temperature, the patent eliminates the need for precise control of dispensing processes. The solid material can be placed without strict requirements for substrate horizontality or process stability, enabling faster, simpler application methods that improve production efficiency.
Solution Approach 2:
The phase transition property allows the material to be applied in a stable solid form that does not require precise dispensing control, then transitions to liquid form during operation to provide the necessary heat conduction. This decouples the application process from strict process control requirements, improving productivity.
3Ease of manufacture
If solid-state thermally conductive material is used, then manufacturing costs are reduced, but heat conduction effectiveness may be compromised
Solution Approach 1:
The patent resolves this contradiction by using phase transition: the material is applied in solid form (enabling simple, low-cost manufacturing processes) and automatically transitions to liquid form during operation (providing effective heat conduction). This eliminates the need for expensive specialized equipment while ensuring thermal performance.
Solution Approach 2:
By changing the physical state parameter based on temperature conditions, the patent enables the material to be handled as a solid during manufacturing (reducing costs) and function as a liquid during operation (maintaining heat conduction effectiveness).
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Simplifies the filling process, reduces manufacturing costs, and enhances production efficiency while ensuring effective heat dissipation without pressure damage to electronic elements.
Implementation Method 1
a solid-state phase-change thermally conductive material is used and is placed between an electronic element and a heat sink. When the electronic element works, the solid-state thermally conductive material melts to a liquid state
Implementation Method 2
the solid-state thermally conductive material melts to a liquid state, to fill a gap between the electronic element and the heat sink
Implementation Method 3
heat is transmitted to a heat sink in a heat conduction manner by using the heat sink in close contact with the electronic element
Data Source
AI summary
This application provides a method for manufacturing a heat dissipation structure of an electronic element, a heat dissipation structure, and an electronic device. The method includes: placing a substrate having an electronic element in an environment that meets a preset temperature condition; and in the environment that meets the preset temperature condition, covering a periphery of the electronic element with a heat dissipation cover, fixedly connecting the heat dissipation cover to the substrate, and placing a solid-state phase-change thermally conductive material in an accommodation cavity surrounded by the substrate and the heat dissipation cover.