Capillary Cooler Bypass Valve for Vapor Pressure and Power Control

Solution Overview

Problem

Conventional cooling systems for electronic devices inefficiently use electricity and lead to excessive vapor pressure buildup due to constant fluid flow, resulting in insufficient cooling.

Innovation Solution

A fluid bypass valve system that controls the flow of cooling fluid, allowing a portion to bypass electronic devices, initiating evaporative cooling at lower power levels and extending its range, while managing vapor pressure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a constant volume of fluid is pumped through electronic devices, then the electronic devices are cooled, but electricity is inefficiently used and vapor pressure builds up excessively

Engineering Contradiction:

Improveelectronic device operating temperatureVSAvoidelectricity consumption

Core Design Contradiction:

TemperatureVSUse of energy by moving object

Solution Approach 1:

The patent implements dynamic fluid flow control by replacing constant volume pumping with a system that adjusts flow rates based on thermal conditions. The fluid flow rate varies dynamically to match the cooling requirements of electronic devices, enabling evaporative cooling to initiate at lower power levels and extend the power range where evaporative cooling is effective. This dynamic adjustment reduces unnecessary electricity consumption while maintaining optimal cooling performance.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The system changes the parameter of fluid flow rate from constant to variable. By monitoring thermal conditions and adjusting the fluid flow rate accordingly, the system optimizes the balance between cooling effectiveness and energy consumption. This parameter change enables the system to operate efficiently across varying power levels while preventing excessive vapor pressure buildup.

Inventive Principle:

Principle #35Parameter changes

2Temperature

If a constant volume of fluid is pumped through electronic devices, then cooling is provided, but evaporative cooling is delayed and vapor pressure builds up excessively

Engineering Contradiction:

Improveelectronic device operating temperatureVSAvoidvapor pressure

Core Design Contradiction:

TemperatureVSStress or pressure

Solution Approach 1:

The patent implements dynamic fluid flow control by replacing constant volume pumping with a system that adjusts flow rates based on thermal conditions. The fluid flow rate varies dynamically to match the cooling requirements of electronic devices, enabling evaporative cooling to initiate at lower power levels and extend the power range where evaporative cooling is effective. This dynamic adjustment reduces unnecessary electricity consumption while maintaining optimal cooling performance.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The system changes the parameter of fluid flow rate from constant to variable. By monitoring thermal conditions and adjusting the fluid flow rate accordingly, the system optimizes the balance between cooling effectiveness and energy consumption. This parameter change enables the system to operate efficiently across varying power levels while preventing excessive vapor pressure buildup.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system efficiently uses electricity to maintain evaporative cooling over a wider power range, reducing energy consumption and preventing vapor pressure buildup.

Implementation Method 1

Evaporative cooling utilizes the phase change of a cooling medium from fluid to vapor to absorb heat during the phase change. The heat may be absorbed from the electronic device.

Methodology Applied

Scientific EffectEvaporative cooling: Evaporation

Implementation Method 2

Evaporative cooling utilizes the phase change of a cooling medium from fluid to vapor to absorb heat during the phase change.

Methodology Applied

Scientific EffectPhase change: Phase Change

Implementation Method 3

The one or more electronic devices may evaporate the fluid and the condenser may condense the fluid.

Methodology Applied

Scientific EffectCondensation: Condensation

Data Source

PatentUS12621962B2Capillary cooling systems for cooling electronic devices and methods thereof

Publication Date: 2026.05.05 TOYOTA JIDOSHA KK

AI summary

The present disclosure is directed to systems and methods for cooling electronic devices. The system includes a capillary cooler assembly comprising a housing, a plurality of feeding tubes within the housing, a wick within the housing, and one or more vapor outlets, a fluid feed line fluidly coupled to the plurality of feeding tubes, a fluid bypass line fluidly coupled to the fluid feed line, a fluid bypass valve fluidly coupled to the fluid feed line and the fluid bypass line, wherein the fluid bypass valve is selectively operable between at least two positions that control a flow of cooling fluid through the fluid bypass line, a vapor line fluidly coupled to the one or more vapor outlets, a condenser fluidly coupled to the fluid bypass line, the vapor line, and the fluid feed line, and a pump fluidly coupled to the condenser and the fluid feed line.