Cable Assembly Interface for Low Profile High Speed Signal Transmission

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Solution Overview

Problem

Existing cable assemblies face challenges in achieving a low profile mating interface and high-speed signal transmission, with increased height and complexity in PCB layout due to the arrangement of PCBs and conductive pads.

Innovation Solution

A cable assembly design featuring a metallic case with a terminal module, metallic clips, and a cable connected to PCBs, along with a latch mechanism and metallic shell, which allows for a compact and efficient high-speed signal transmission while maintaining a lower profile.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Speed

If a pair of PCBs are arranged paralleled in a vertical direction to achieve high-speed signal transmission, then the signal transmitting speed is improved, but the height of the mating interface is increased

Engineering Contradiction:
Improvesignal transmitting speedVSAvoidheight of mating interface
Core Design Contradiction:
SpeedVSLength of stationary object

Solution Approach 1:

The patent transitions from a vertical arrangement of PCBs (increasing height) to a horizontal arrangement where multiple PCBs are disposed side-by-side. This dimensional change allows high-speed signal transmission capabilities to be maintained while reducing the height of the mating interface to meet low-profile requirements.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent divides the connection interface into multiple independent PCBs arranged horizontally, with each PCB containing a subset of conductive pads. This segmentation allows the total number of signal paths to be maintained for high-speed transmission while distributing them across multiple smaller units that collectively occupy less vertical space.

Inventive Principle:
Principle #1Segmentation

2Speed

If more conductive pads are formed on the PCB to increase signal transmitting speed, then the signal transmitting speed is improved, but the layout of the printed circuit board becomes more difficult to design

Engineering Contradiction:
Improvesignal transmitting speedVSAvoidPCB layout complexity
Core Design Contradiction:
SpeedVSDevice complexity

Solution Approach 1:

The patent segments the total required conductive pads across multiple separate PCBs rather than concentrating them on a single large PCB. Each individual PCB has a manageable number of pads and simpler routing requirements, making layout design more straightforward while the collective assembly provides the necessary high-speed signal transmission capacity.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS8562369B2Cable assembly with a new interface
Publication Date: 2013.10.22 HON HAI PRECISION INDUSTRY CO LTD
  • US8562369B2 patent drawing
  • US8562369B2 patent drawing
  • US8562369B2 patent drawing

AI summary

A cable assembly (100), comprises: a metallic case (1) having a receiving room; a terminal module (2) disposed in the receiving room; a plurality of metallic clips (9) assembled to a front end of the terminal module; and a cable (8) extended into the receiving room and electrically connected with the terminal module.