Cable Connector Thermal Shielding for IC Heat Sinks

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Solution Overview

Problem

Conventional integrated circuit assemblies face challenges in meeting signal and power output requirements due to limited surface area for conductors, and conventional cable connector assemblies may be damaged by heat sinks, necessitating improved electrical performance and thermal protection.

Innovation Solution

A cable connector assembly with a housing that supports a heat sink and includes thermal shields to create a barrier between cables and the heat sink, allowing for higher density connections and efficient heat dissipation while protecting cables from thermal damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional cable connector assemblies are used near heat sinks, then heat dissipation is achieved, but cables are damaged by thermal exposure

Engineering Contradiction:
Improveheat dissipationVSAvoidthermal damage to cables
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

A thermal shield made of thermally conductive material is positioned between the heat sink and cables to intercept and redirect heat away from the cables. The shield acts as an intermediary that protects cables from thermal exposure while maintaining the heat dissipation function of the heat sink.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The housing is designed with differentiated thermal properties in different regions - the area near the heat sink uses thermally conductive material to dissipate heat, while the area containing cables uses thermally insulating material to protect them. This local differentiation of thermal properties resolves the contradiction between heat dissipation and cable protection.

Inventive Principle:
Principle #3Local quality

2Reliability

If surface area for conductors is increased to meet signal and power output requirements, then electrical performance improves, but the limited bottom surface area of integrated circuit assemblies constrains this expansion

Engineering Contradiction:
Improveelectrical performanceVSAvoidbottom surface area
Core Design Contradiction:
ReliabilityVSArea of stationary object

Solution Approach 1:

The connector assembly transitions from a two-dimensional surface mount configuration to a three-dimensional structure that extends vertically from the integrated circuit assembly. This dimensional transition allows multiple conductors to be stacked and arranged in vertical space rather than being constrained to the limited bottom surface area, thereby maintaining electrical performance without increasing the footprint.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

Multiple conductors and cable assemblies are nested within the housing structure, with conductors arranged in rows and columns that utilize the internal volume of the connector assembly. This nesting approach allows high-density conductor arrangements that exceed what would be possible on the limited bottom surface area alone.

Inventive Principle:
Principle #7Nested doll (Nesting)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances electrical performance and thermal protection, enabling higher density connections and efficient heat dissipation, thus addressing the limitations of conventional systems.

Implementation Method 1

The thermal shield has a thermal shielding wall positioned between the cables and the heat sink to provide a thermal barrier between the cables and the heat sink

Methodology Applied
Scientific EffectThermal barrier: Thermal Insulation

Implementation Method 2

The second end is configured to support a heat sink used to dissipate heat from the integrated circuit component

Methodology Applied
Scientific EffectHeat dissipation: Heat Sink

Data Source

PatentUS10811800B1Cable connector assembly for an integrated circuit assembly
Publication Date: 2020.10.20 TE CONNECTIVITY SOLUTIONS GMBH
  • US10811800B1 patent drawing
  • US10811800B1 patent drawing
  • US10811800B1 patent drawing

AI summary

A cable connector assembly includes a housing having a first end mounted to an integrated circuit substrate over an integrated circuit component and a second end supporting a heat sink used to dissipate heat from the integrated circuit component. The housing includes a pocket receiving a cable module having a connector housing holding conductors and cables connected to the conductors. The connector housing has a mating end facing the integrated circuit substrate with the conductors arranged at the mating end for interfacing with integrated circuit conductors. A thermal shield is received in the pocket having an opening receiving the cables. The thermal shield has a thermal shielding wall positioned between the cables and the heat sink to provide a thermal barrier between the cables and the heat sink.