Vehicular Camera Heat Staking Lens Alignment
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Solution Overview
Problem
Current vehicle vision systems face challenges in efficiently and cost-effectively aligning and focusing camera lenses with imaging sensors due to the use of expensive and complex methods, such as active PCB alignment and quick cure adhesives, which increase tolerance stacks and assembly costs.
Innovation Solution
The system employs non-contact heat staking to secure the lens holder to the imager printed circuit board, allowing for multi-axis adjustment and focus alignment without the need for quick cure adhesives or UV curing, using heat to deform and solidify stakes that secure the lens in place relative to the imager.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If active PCB alignment and quick cure adhesives are used to align and focus camera lenses with imaging sensors, then alignment precision can be achieved, but assembly costs increase and tolerance stacks are enlarged
Solution Approach 1:
The patent extracts and eliminates the complex quick cure adhesive application process and UV curing step from the assembly process. Instead of using adhesives to secure the lens holder to the PCB, the invention uses mechanical stakes with oversized holes that allow for alignment adjustments without requiring chemical bonding processes, thereby simplifying the overall assembly process while maintaining alignment precision
Solution Approach 2:
The patent segments the alignment and securing functions into distinct mechanical components: stakes for positioning, oversized holes for adjustment, and a mechanical interlocking system. This segmentation allows each component to perform its specific function independently, enabling precision alignment through mechanical means rather than relying on complex adhesive processes
2Strength
If quick cure adhesives and UV curing processes are used to secure the lens holder, then bonding strength is achieved, but assembly cycle time increases and production costs increase
Solution Approach 1:
The patent replaces the chemical bonding system (adhesives and UV curing) with a mechanical securing system using stakes and oversized holes. The mechanical interlocking provides sufficient bonding strength through physical interference and friction, eliminating the need for time-consuming adhesive application and curing processes, thereby significantly reducing assembly cycle time and improving productivity
Solution Approach 2:
The patent incorporates alignment adjustments during the staking process itself, before final securing. The oversized holes allow for preliminary positioning and focus alignment to be completed while the stakes are being inserted, eliminating the need for separate alignment and bonding steps, thus reducing overall assembly time
3Manufacturing precision
If tolerance stacks are reduced for micron-level alignment accuracy, then alignment precision improves, but manufacturing complexity and cost increase
Solution Approach 1:
The patent introduces dynamic adjustability through oversized holes that accommodate stake movement during the assembly process. This dynamic system allows for real-time alignment adjustments and focus tuning after the components are assembled, enabling micron-level accuracy to be achieved through adjustment rather than requiring extremely tight manufacturing tolerances, thereby simplifying manufacturing
Solution Approach 2:
The patent changes the geometric parameters of the mounting system by using oversized holes instead of precision-fit holes. This parameter change allows for stake displacement and rotation within the holes, providing adjustment capability that compensates for manufacturing variations and enables high alignment accuracy without requiring complex manufacturing processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces assembly tolerances, eliminates the need for expensive adhesives and curing processes, enhances thermal transfer, decreases cycle time, and maintains micron-level accuracy in lens alignment, while simplifying the assembly process and reducing capital requirements.
Implementation Method 1
the stakes or posts are heated to melt or deform so as to retain the circuit board in position relative to the lens when the stakes cool and re-solidify or harden
Implementation Method 2
the stakes or posts are heated to melt or deform so as to retain the circuit board in position relative to the lens when the stakes cool and re-solidify or harden
Data Source
AI summary
A vehicular camera includes a lens holder accommodating a lens and an imager printed circuit board (imager PCB). The lens holder includes a plurality of posts protruding from an attaching portion of the lens holder. The imager PCB includes an imager disposed at a first side of the imager PCB, and includes a plurality of apertures therethrough. The attaching portion of the lens holder is positioned at the imager PCB such that the posts protrude through the apertures of the imager PCB. The posts are movable within the apertures while the lens is adjusted relative to the imager to align the lens relative to the imager. With the lens aligned relative to the imager, the posts are heated to deform within the apertures, whereby the deformed posts harden upon cooling to secure the lens holder relative to the imager PCB.