Asymmetrical ground conductor patterns redirect leaked microwaves to minimize crosstalk between signal lines.
Multi-level rigid-flex circuit board accommodates height differences between CFP and CFP2 form factors while maintaining high-speed signal integrity.
Dummy region trenches in a trench substrate improve plating deviation, preventing separation of fine circuit patterns from the insulating layer.
A printed conductor fuse uses a non-linear blow region and selective covering to interrupt current flow.
Asymmetrical leadframes position leads at varying distances from the center line to adjust impedance, resolving mismatches caused by high-density integration.
An insulative film covers flexible printed circuit terminal ends within the film outline to prevent water penetration and corrosion in severe environments.