High-Frequency Module Shielding Noise Interference
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Solution Overview
Problem
High-frequency modules lack effective shielding between components on a wiring board, leading to mutual noise interference, as the existing ground electrode on the bottom surface does not completely surround the components and allows noise to enter from gaps between electrodes.
Innovation Solution
A high-frequency module design that includes a shield member and shield film within the sealing-resin layer, surrounded by connection conductors, with a shield electrode on the opposite surface of the wiring board to prevent noise interference from both surfaces, and reduces connection resistance by grounding the shield electrode to an external substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a ground electrode is formed on the bottom surface of the wiring board to provide shielding, then shielding is provided for the components, but the components are not completely surrounded by the shield and noise can enter from gaps between the ground electrode and other electrodes
Solution Approach 1:
The shield is divided into multiple segments: a shield film on the top surface, a shield member within the sealing-resin layer, and a shield electrode on the bottom surface. Each segment addresses specific shielding needs, collectively providing complete surrounding protection that eliminates gaps and prevents noise entry from all directions.
Solution Approach 2:
The shielding structure transitions from a two-dimensional ground electrode on the bottom surface to a three-dimensional comprehensive shield system that extends through the sealing-resin layer and covers all surfaces. This multi-layered approach in different spatial dimensions ensures complete surrounding protection of the components.
2Device complexity
If no shield is provided between components on the wiring board, then the structure remains simple, but mutual noise interference between components cannot be prevented
Solution Approach 1:
The shield member is selectively positioned within the sealing-resin layer at specific locations between components that require shielding. This localized approach provides targeted noise protection between adjacent components while maintaining overall structural simplicity and avoiding unnecessary complexity in areas where shielding is not needed.
3Length of stationary object
If the shield electrode is disposed on the second main surface of the wiring board, then the connection wiring line length between the shield member and ground electrode can be reduced, but the shield must be properly connected to ground
Solution Approach 1:
The shield electrode on the second main surface is electrically connected to the ground electrode through connection conductors, creating an equipotential ground reference. This ensures that the shield member maintains a stable zero-potential reference while minimizing connection length, thereby reducing connection resistance and ensuring reliable grounding.
Data Source
AI summary
Provided is a high-frequency module capable of improving a shielding performance for a specific component. In a high-frequency module 1a, a component 3c that is mounted on a top surface 20a of a multilayer wiring board 2 is surrounded by a shield film 6 coating a surface of a sealing-resin layer 4, a plurality of metallic pins 5a arranged in the sealing-resin layer 4 so as to surround the component 3c, an outer electrode 8c formed on a bottom surface 20b of the multilayer wiring board 2 so as to be located at a position that overlaps with the component 3c when viewed in a direction perpendicular to the top surface 20a of the multilayer wiring board 2, and a plurality of connection conductors (via conductors 10b and pad electrodes 11) connecting the metallic pins 5a and the outer electrode 8c to one another.