Integrated Circuit Shield and Vertical Interconnects
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Solution Overview
Problem
Conventional integrated circuit packaging systems face challenges in efficiently forming robust vertical interconnects and electromagnetic interference (EMI) shields, which are complex, costly, and cumbersome to fabricate, especially as consumer electronics operate at increasingly higher frequencies, leading to increased EMI interference.
Innovation Solution
The method involves providing a substrate, mounting an integrated circuit, forming an encapsulant around it, and simultaneously creating a shield structure and vertical interconnects within the encapsulant, using conductive material to contact the ground ring pad and conductive pad, thereby forming a robust EMI shield and interconnects in a single process step.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metallic enclosure is fabricated and separately attached to the printed circuit board, then electromagnetic shielding is achieved, but the process becomes cumbersome, complex, and costly
Solution Approach 1:
The patent merges the EMI shield and vertical interconnect formation into a single simultaneous process step. The conductive material is deposited to form both the shield structure and vertical interconnects in one operation, eliminating the need for separate fabrication and attachment steps. This is achieved through conformal deposition techniques that deposit conductive material over the encapsulant and substrate, forming both structures concurrently.
Solution Approach 2:
The conductive material deposition process serves multiple functions simultaneously: it forms the EMI shield structure, creates vertical interconnects, and establishes electrical connections to ground ring pads and conductive pads. This multi-functional approach replaces multiple specialized processes with a single universal deposition operation.
2Reliability
If conventional separate processes are used to form EMI shield and vertical interconnects, then each structure can be optimized independently, but manufacturing time and cost increase
Solution Approach 1:
The patent combines the formation of EMI shields and vertical interconnects into a single simultaneous deposition process. The conductive material is applied conformally over the entire structure, creating both shield and interconnect elements in one operation, thereby maintaining structural integrity while dramatically improving manufacturing efficiency.
3Speed
If the integrated circuit operates at higher frequencies, then performance improves, but electromagnetic interference increases
Solution Approach 1:
The patent applies preliminary anti-action by forming the EMI shield structure simultaneously with the vertical interconnects during the packaging process, before the integrated circuit begins high-frequency operation. The shield is pre-positioned and electrically connected to ground ring pads, creating immediate protection against the electromagnetic radiation that will be generated during high-frequency operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the manufacturing process, reduces costs, and enhances EMI shielding and thermal performance by integrating the shield and interconnects directly into the packaging system, optimizing EMI protection and thermal dissipation while reducing manufacturing time and complexity.
Implementation Method 1
an electromagnetic shielding system can limit the penetration of electromagnetic fields into a space, by blocking them with a barrier made of conductive material
Implementation Method 2
forming a vertical interconnect structure... a vertical interconnect within the encapsulant in contact with the conductive pad
Data Source
AI summary
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting a first integrated circuit over the substrate; forming an encapsulant around the first integrated circuit and over the substrate; and forming a shield structure within and over the encapsulant while simultaneously forming a vertical interconnect structure.