Surface-Mount High-Frequency Circuit Ground Conductor Arrangement
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Solution Overview
Problem
Conventional surface mount high-frequency circuits face complexity in manufacturing due to the need for separate metallization processes and increased component counts, particularly in suppressing unnecessary signal radiation.
Innovation Solution
A surface mount high-frequency circuit design featuring a first substrate with interlayer connection ground and signal line conductors, and a second substrate with ground and signal line conductors, where discrete ground conductor connection members surround signal line conductor connection members, allowing for suppression of unnecessary signal radiation without a shield cover case, completed by a simple wafer process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a shield cover case is arranged outside the chip to suppress radiation, then radiation suppression is improved, but the number of components increases
Solution Approach 1:
The patent integrates the radiation suppression function directly into the chip structure by forming ground conductors on the chip substrate itself, merging the shielding function with the circuit substrate. This eliminates the need for a separate shield cover case while maintaining radiation suppression effectiveness.
Solution Approach 2:
The chip structure serves its own shielding needs by incorporating ground conductors that act as both circuit elements and radiation suppression elements. The chip substrate provides its own electromagnetic shielding through the integrated ground conductor configuration without requiring external shielding components.
2Object-affected harmful factors
If metallization is applied to the upper surface and side surfaces of the chip, then radiation suppression is improved, but manufacturing complexity increases
Solution Approach 1:
The patent combines the ground conductor formation with the existing circuit pattern formation process. The ground conductors are formed using the same wafer-level metallization processes already used for creating circuit patterns, merging two functions into one integrated manufacturing flow.
Solution Approach 2:
The ground conductors are formed during the wafer fabrication process before chip separation, performing the radiation suppression structure creation in advance. This preliminary action at the wafer level eliminates the need for additional metallization steps after chip separation.
3Object-affected harmful factors
If ground conductors are formed on the chip substrate, then radiation suppression is improved, but the manufacturing process becomes more complex
Solution Approach 1:
The ground conductors serve multiple functions: they provide electromagnetic shielding, establish reference potential planes for high-frequency circuits, and can be interconnected through via holes to create three-dimensional grounding structures. This multi-functionality is achieved using standard semiconductor manufacturing processes.
Solution Approach 2:
The patent extends ground conductors into the thickness direction of the chip using via holes that penetrate through insulating layers. This three-dimensional grounding structure provides enhanced radiation suppression by creating enclosed shielding volumes, adding a vertical dimension to the traditional planar ground conductor configuration.
Data Source
Figure 1~2(c)
Figure 3~4
Figure 5(a)~6
AI summary
A surface mount high-frequency circuit is configured such that a plurality of ground pads 41 and a plurality of external connection ground conductors 51 are discretely disposed to surround a signal line pad 42 and an external connection signal line conductor 52, and a plurality of interlayer connection ground conductors 31 and that a plurality of columnar ground conductors 12 are discretely disposed to surround an interlayer connection signal line conductor 32. Thus, it is possible to suppress radiation of an unnecessary signal to the outside using a simple production process that is completed by only a wafer process without separately preparing a component such as a shield cover case.