Surface Mount Module Substrate Integrated Waveguide Signal Loss
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Solution Overview
Problem
Existing surface mount microwave signal transfer systems experience significant signal loss and limitations at frequencies above 40 GHz due to the transition from microstrip to Coplanar Waveguide, making it difficult to maintain efficient signal flow at higher frequencies.
Innovation Solution
The implementation of a Substrate Integrated Waveguide (SIW) within the surface mount module, utilizing metallized trenches or densely arranged via-holes to connect microstrip conductors on opposite sides of the substrate, forming an electromagnetic waveguide that reduces signal loss and enables efficient high-frequency signal transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a Coplanar Waveguide system is used to connect microstrip conductors on opposite sides of the substrate, then the module can be manufactured using standard SMT processes, but significant signal loss occurs at frequencies above 40 GHz
Solution Approach 1:
The patent changes the fundamental transmission line parameter from Coplanar Waveguide to Substrate Integrated Waveguide (SIW). This parameter change enables the system to maintain low signal loss at high frequencies (above 40 GHz) while still being compatible with standard SMT manufacturing processes, thus resolving the contradiction between ease of manufacture and signal loss.
Solution Approach 2:
The patent substitutes the Coplanar Waveguide transmission line structure with a Substrate Integrated Waveguide structure. This substitution replaces the conventional microstrip-to-Coplanar Waveguide-to-microstrip path with an SIW-based transmission path, which has lower signal loss characteristics at high frequencies while maintaining SMT manufacturability.
2Extent of automation
If Chip On Board (COB) solutions are used to achieve full SMT manufacturing and reduce cost, then manufacturing automation is improved, but repairability and ease of replacement deteriorate
Solution Approach 1:
The patent segments the microwave system into a reusable package module and a motherboard, connected via the SIW transmission line. This segmentation allows the package to be easily replaced or repaired by removing and replacing the entire module, maintaining ease of repair while enabling full SMT manufacturing automation through the standardized SIW connection interface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for the automatic assembly of Surface Mount Device (SMD) modules capable of handling signals up to 100 GHz or higher, surpassing the limitations of prior art systems by minimizing signal loss and ensuring smooth signal transfer at elevated frequencies.
Implementation Method 1
electrically conducting trenches running through the substrate from the first side to the second side of the substrate forming a substrate integrated waveguide
Data Source
AI summary
The application concerns a surface mount module adapted for transfer of a microwave signal between the module and a motherboard, the module comprising a substrate with a first microstrip conductor and a second microstrip conductor, wherein the two conductors are connected with a connection through the module. The module is distinguished in that the connection comprises the first microstrip conductor connected to a foil of electrically conducting material coated on the first side, the foil being surrounded by electrically conducting trenches running through the substrate from the first side to the second side forming a substrate integrated waveguide, wherein the trenches on the second side surrounds a second foil of electrically conducting material coated on the second side of the substrate and connected the second microstrip conductor. The application also concerns a coupling arrangement.