Flexible Wiring System with Multi-Layer Interleaved Conductors
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Solution Overview
Problem
Existing wiring systems face limitations in compactness and electrical performance due to minimum distance constraints between conductors to avoid cross talk and electromagnetic interference, and conventional pseudo-twisted arrangements are restricted to single-layer configurations with limited adaptability.
Innovation Solution
A flexible wiring system with conductors deposited on multiple layers or interweaved to achieve a twisted configuration, using thin conductive materials and insulating layers to allow close proximity and reduce cross talk, while enabling selective shielding and integration of components for specific applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conductors are placed closer together to achieve compact arrangement, then volume and area are reduced, but electromagnetic interference and cross talk increase
Solution Approach 1:
The patent transitions from conventional single-plane conductor arrangements to multi-layer configurations where conductors are distributed across multiple substrate layers. This dimensional change allows conductors to be positioned closer in 3D space while maintaining adequate separation in the vertical dimension through insulation layers, thereby reducing volume without increasing electromagnetic interference.
Solution Approach 2:
The patent implements nested shielding structures where conductors are surrounded by insulating material and positioned within multi-layer assemblies. Inner conductors are nested within protective insulation, which is nested within the overall cable structure, creating concentric arrangements that contain electromagnetic fields and reduce cross-talk between adjacent conductors.
2Reliability
If conductor thickness is increased to improve electrical characteristics, then electrical performance is improved, but flexibility and compactness deteriorate
Solution Approach 1:
The patent employs composite conductor structures combining copper or aluminum cores with flexible polymer coatings or laminations. This composite approach maintains excellent electrical conductivity from the metal core while the flexible coating layer provides bendability and adaptability, allowing the conductor to meet both electrical performance and flexibility requirements simultaneously.
Solution Approach 2:
The patent applies thin flexible insulating films and polymer coatings over conductor surfaces. These thin film layers provide necessary electrical insulation and mechanical flexibility without significantly increasing overall conductor thickness, thereby maintaining compact dimensions while improving adaptability to contoured surfaces and reducing stiffness.
3Object-affected harmful factors
If conventional pseudo-twisted arrangements are used to reduce cross talk, then electromagnetic interference is reduced, but structural complexity and manufacturing limitations increase
Solution Approach 1:
The patent divides the conductor assembly into discrete segments across multiple layers, with each layer containing specific conductor pairs separated by insulation. This segmentation allows systematic arrangement of conductors to minimize cross-talk through controlled spacing and positioning, while simplifying manufacturing compared to continuous twisting operations.
Solution Approach 2:
The patent replaces the mechanical twisting process with a deposition-based construction approach. Instead of mechanically twisting conductors together, the system uses layered deposition of conductors and insulation materials in controlled patterns, substituting complex mechanical assembly with more manageable deposition and lamination processes.
4Object-affected harmful factors
If minimum distance between conductors is increased to avoid cross talk, then electromagnetic interference is reduced, but volume and area increase
Solution Approach 1:
The patent utilizes the vertical dimension by distributing conductors across multiple substrate layers separated by insulation. This allows conductors to be positioned closer in plan view area while maintaining adequate separation distances in the vertical dimension, effectively reducing the footprint area without compromising cross-talk performance through multi-layer stacking.
Data Source
Figure 1(a)~1(d)
Figure 2(a)~2(e)
Figure 3~6
AI summary
A wiring system comprises a flexible substrate and at least one pair of conductors deposited on the substrate, wherein the conductors are each arranged in a pattern defining a respective conductive path, and the paths of the pair of conductors are arranged to cross one another at a plurality of crossover points, and wherein the conductors of the or each pair are arranged on the same side of the substrate.