Flexible Substrate Heat Dissipation Structure with Phase Change Material
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Solution Overview
Problem
Electronic devices face uneven temperature distribution due to heat sinks, where temperatures near the heat source are higher than elsewhere, leading to inefficient heat dissipation.
Innovation Solution
A heat dissipation structure comprising a flexible substrate with defined grooves filled with a phase changing material and a graphite sheet with recesses, connected via adhesive layers, which absorbs heat from the source and dissipates it uniformly through the substrate and cover plate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a heat sink is used to dissipate heat from electronic elements, then heat dissipation capability is improved, but temperature uniformity deteriorates (temperature near heat source becomes higher than other portions)
Solution Approach 1:
The heat dissipation structure is segmented into multiple functional layers: a flexible substrate with grooves, phase changing material filling the grooves, a graphite sheet with recesses, and a cover plate. This segmentation allows each layer to perform specific heat management functions, with the phase changing material absorbing heat locally and the graphite sheet distributing it uniformly across the structure.
Solution Approach 2:
The patent utilizes phase changing material (such as phase change wax) that transitions from solid to liquid state when absorbing heat from the heat source. This phase transition process absorbs large amounts of latent heat, effectively reducing the temperature near the heat source and improving temperature uniformity across the electronic device.
Solution Approach 3:
The heat dissipation structure employs composite materials including the flexible substrate (metal or polymer), phase changing material (organic or inorganic), graphite sheet (carbon-based), and adhesive layers. This composite structure combines the advantages of different materials: the flexible substrate provides structural support, the phase changing material provides latent heat absorption, and the graphite sheet provides high thermal conductivity for uniform heat distribution.
2Temperature
If phase changing material is filled in grooves of flexible substrate, then temperature uniformity is improved, but device complexity increases
Solution Approach 1:
The structure employs a nested configuration where the grooves are defined within the flexible substrate, the phase changing material is filled within the grooves, the graphite sheet with recesses is positioned above, and the cover plate seals the top. This nesting approach maximizes heat management functionality within a compact, integrated structure, reducing overall device complexity while maintaining temperature uniformity.
Solution Approach 2:
The use of a flexible substrate as the base layer allows the entire heat dissipation structure to be thin and adaptable to the electronic device's surface. The flexibility enables the structure to conform to various device geometries without requiring complex rigid frameworks, thereby improving temperature uniformity while minimizing structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures uniform heat dissipation, reducing temperature variations across the electronic device and enhancing cooling efficiency.
Implementation Method 1
at least one groove (11) is defined from a first surface (101) toward a second surface (102) of the flexible substrate (10). A phase changing material (30) is filled in each groove (11)
Implementation Method 2
a phase changing material (30) is filled in each groove (11) to define a sealed cavity (50) with the cover plate (40)
Implementation Method 3
a graphite sheet (60) with at least one lower recess (62) defined at a third surface (61) of the graphite sheet (60). The third surface (61) of the graphite sheet (60) is connected to the second surface (102) of the flexible substrate (10)
Data Source
AI summary
An electronic device includes a heat dissipation structure. The heat dissipation structure comprises a flexible substrate, a graphite sheet, and a heat insulating material. The flexible substrate comprises a first surface and a second surface facing away from the first surface. The flexible substrate is disposed on the graphite sheet, and the second surface faces the graphite sheet. At least one containing cavity is formed between the flexible substrate and the graphite sheet. The heat insulating material is filled in the containing cavity. A cover plate is disposed on the first surface. At least one groove is formed on the flexible substrate from the first surface to the second surface. The groove is sealed by the cover plate to formed a sealed cavity. A phase changing material is filled in the sealed cavity.