Multilayer Circuit Tri-Plate Side-Surface Ground Conductor
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Solution Overview
Problem
High frequency circuits using multilayer boards face challenges in reducing the distance between elements for wider functionality, achieving parallel feeding, and efficiently connecting tri-plate structures across layers while minimizing space and maintaining good circuit characteristics.
Innovation Solution
A circuit structural body with a multilayer board featuring tri-plate structures connected by a conductor, including a side-surface ground conductor parallel to the interlayers connection conductor, which reduces occupied area and maintains high frequency characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of layers in the multilayer board is increased to achieve higher frequency circuit functionality, then the circuit functionality and frequency range are improved, but the occupied area and design complexity increase due to required connection space
Solution Approach 1:
The patent introduces a side-surface ground conductor on the lateral surface of the multilayer board, transitioning the ground reference from a planar two-dimensional configuration to a three-dimensional structure. This dimensional change allows the tri-plate structures in different layers to be connected through the side surface, reducing the occupied area on the board's main surface while maintaining proper grounding and circuit functionality across multiple layers
2Reliability
If tri-plate structures in different layers are connected by through-hole plating, then interlayer connection is achieved, but uniform joining becomes difficult and manufacturing complexity increases
Solution Approach 1:
The patent extracts the ground conductor function from the traditional through-hole plating structure and places it on the side surface of the board. This separation allows the interlayer connection to be achieved more easily through conductor patterns on the side surface, which are simpler to manufacture uniformly compared to through-hole plating across multiple layers
Solution Approach 2:
The side-surface ground conductor acts as an intermediary element that facilitates connection between tri-plate structures in different layers. Instead of directly connecting through holes across multiple layers, the side-surface conductor provides an intermediate path that simplifies the manufacturing process while maintaining reliable electrical connection
3Adaptability or versatility
If more layers are added to support parallel feeding and narrowed element distance, then the antenna functionality and frequency range are improved, but the space requirements for connections and design constraints increase
Solution Approach 1:
By utilizing the side surface of the multilayer board for ground conductor placement, the patent creates an additional dimensional space for circuit connections. This allows parallel feeding structures and multiple tri-plate lines to be arranged more compactly on the board's main surface, reducing design constraints while supporting enhanced antenna functionality
Data Source
Figure 1(a)~1(d)
Figure 2(a)~2(d)
Figure 3(a)~3(b)
AI summary
Provided is a circuit structural body is formed into a shape including: A circuit structural body, including: a multilayer board, which includes a plurality of layers of a first to N-th tri-plate structural bodies each including a first to N-th (N is an integer of 2 or more) planar conductors; an interlayers connection conductor, which is configured to connect the first to N-th planar conductors to each other; and a side-surface ground conductor, which is formed on a side surface of the multilayer board, and is approximately parallel to and near the interlayers connection conductor.