Electronic Module With Multi-Level Solid Wiring Board
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Solution Overview
Problem
Existing electronic modules face challenges in achieving miniaturization while maintaining reliability and integration, particularly in compact designs such as endoscopes, where components need to be efficiently packed within limited spaces without protruding beyond the mounting area.
Innovation Solution
The design incorporates a solid wiring board with multiple mounting surfaces, including a second and third mounting surface with different distances from the integrated circuit, allowing for the efficient placement and electrical connection of electronic components between these surfaces, enabling compact module configurations without expanding the mounting area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electronic components are stacked vertically with multiple mounting surfaces at different distances, then integration density and miniaturization are improved, but manufacturing complexity and assembly difficulty increase
Solution Approach 1:
The patent transitions from traditional planar mounting to three-dimensional vertical stacking, utilizing multiple mounting surfaces at different distances from the integrated circuit. This dimensional change allows components to be arranged in the vertical direction rather than only horizontally, achieving miniaturization by reducing the horizontal footprint while managing complexity through structured vertical integration.
Solution Approach 2:
The patent implements nested arrangement where electronic components are positioned within the vertically projected area of the integrated circuit. The second mounting surface is located within the horizontally projected area of the integrated circuit, and the third mounting surface is positioned at a greater distance, creating a nested configuration that maximizes space utilization and reduces overall module volume.
2Area of stationary object
If components are arranged within the projected area of the integrated circuit, then miniaturization is achieved, but electrical connection complexity increases
Solution Approach 1:
The patent divides the electrical connection system into segmented layers corresponding to different mounting surfaces. Each mounting surface (second and third) has its own set of connection terminals that interface with the integrated circuit, allowing connections to be managed in discrete segments rather than as a complex monolithic structure. This segmentation simplifies the routing and connection management despite the three-dimensional arrangement.
3Productivity
If multiple mounting surfaces are used at different distances, then integration density improves, but mechanical stress and reliability challenges increase
Solution Approach 1:
The patent applies different structural characteristics to different regions of the module. The mounting surfaces are positioned at specific distances from the integrated circuit based on local requirements: the second mounting surface is closer for certain connections, while the third mounting surface is positioned farther away for other components. This localized optimization allows the structure to accommodate varying mechanical and electrical requirements, managing stress distribution across different regions.
Data Source
AI summary
An electronic module includes: an integrated circuit including a first mounting surface; a solid wiring board including a second mounting surface and a third mounting surface within a horizontally projected area corresponding to the integrated circuit; both the second and third mounting surfaces face the first mounting surface of the integrated circuit and disposed at positions with different distances to the first mounting surface. An electrode surface of an electronic component mounted in a space formed between the first and the third mounting surfaces, and an electrode surface of the second mounting surface are arranged substantially parallel to a surface of the integrated circuit on which electrodes are aligned. The electrode on the second mounting surface and the electrodes of the integrated circuit are electrically connected to each other. The electrode of the electronic component is electrically connected to the electronic component and the electrodes of the integrated circuit.