Circuit Substrate With Common Land Via Conductors
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Solution Overview
Problem
Existing circuit substrates face challenges in efficiently connecting metal blocks to core substrates while maintaining flexibility for specification changes and ensuring reliable heat dissipation, as they often require complex reconfiguration of via conductors and pads.
Innovation Solution
A circuit substrate design featuring a core substrate with a cavity accommodating a metal block, covered by build-up layers with insulating resin and via conductors, including a common land that connects multiple via conductors in parallel, allowing for flexible pad formation and improved heat dissipation through roughened metal block surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If via conductors are reconfigured during specification changes, then connection flexibility is improved, but manufacturing complexity and time increase
Solution Approach 1:
The patent applies preliminary action by pre-forming common lands that can accommodate multiple via conductor configurations. The common land structure is prepared in advance during the base manufacturing process, allowing via conductors to be connected to different locations without requiring reconfiguration of the land itself. This enables specification changes to be implemented by simply adding or removing via conductors rather than reconfiguring the entire connection structure, thereby reducing manufacturing time while maintaining flexibility.
2Temperature
If metal block contact area with insulating resin is increased, then heat dissipation is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies local quality by creating a roughened surface on the metal block at the specific location where it contacts the insulating resin. Instead of requiring high precision across the entire metal block interface, the roughening is applied locally to increase the contact area between the metal block and insulating resin. This localized treatment improves heat dissipation at the critical interface without imposing stringent precision requirements on the overall manufacturing process, as the roughened surface naturally accommodates variations in positioning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the flexibility of pad formation and reduces the need for reconfiguring via conductors during specification changes, while stabilizing the metal block and improving heat dissipation efficiency by increasing the contact area between the metal block and insulating resin.
Implementation Method 1
an insulating resin layer that respectively covers front and back sides of the cavity and the metal block
Implementation Method 2
improving heat dissipation efficiency by increasing the contact area between the metal block and insulating resin
Data Source
AI summary
A circuit substrate includes a core substrate having a cavity, a metal block accommodated in the cavity of the core substrate, a first build-up layer including an insulating resin layer and laminated on a first surface of the core substrate such that the insulating resin layer is covering a first surface of the metal block in the cavity, and a second build-up layer including an insulating resin layer and laminated on a second surface of the core substrate such that the insulating resin layer is covering a second surface of the metal block in the cavity. The second build-up layer includes via conductors connected to the second surface of the metal block and common lands connecting the via conductors in parallel.