Trench Substrate Plating Deviation Control
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Solution Overview
Problem
Conventional semi-additive processes for forming circuit patterns on printed circuit boards result in raised structures that are prone to separation due to decreased bonding area and adhesive force, especially as circuit patterns become finer, and the Laser Patterning Process faces limitations in achieving even surfaces due to plating deviations.
Innovation Solution
A trench substrate with trenches in both the circuit region and a dummy region at the peripheral edge, where the plating process is optimized by forming a circuit layer in the trenches and using second trenches in the dummy region to improve plating deviation, allowing for even plating thickness and enhanced adhesive force through additional insulating layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional semi-additive process is used to form circuit patterns, then fine circuit patterns can be achieved, but the raised circuit patterns are prone to separation from the insulating layer due to decreased bonding area and adhesive force
Solution Approach 1:
Instead of forming raised circuit patterns on the insulating layer surface, the invention inverts the approach by forming recessed trenches in the insulating layer and filling them with conductive material. This creates embedded circuit patterns that are mechanically interlocked with the insulating layer, dramatically improving adhesive force and preventing separation while maintaining fine pattern capability
2Ease of manufacture
If the Laser Patterning Process is used to form trenches, then circuit patterns can be formed through plating, but plating deviations occur that prevent achieving even surfaces
Solution Approach 1:
The invention changes the geometric parameters of the trenches by forming tapered trenches with wider openings at the top and narrower bottoms. This parameter modification allows the plating process to deposit uniform thickness material throughout the trench volume, compensating for plating deviations and enabling achievement of even surfaces after polishing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution reduces plating deviations and enhances the adhesive force between the insulating layer and the circuit pattern, preventing separation and improving the reliability of the circuit pattern formation, while also simplifying the manufacturing process by allowing for easier removal of surplus plating layers.
Implementation Method 1
an electroless plating layer 18 is formed on the insulating layer 2 and the internal surface of the via-hole 16 formed in the insulating layer 12
Implementation Method 2
the electrolytic plating layer 24 is formed in both the via-hole 16 and the openings 22
Data Source
AI summary
Disclosed herein are a trench substrate and a method of manufacturing the same. The trench substrate includes a base substrate, an insulating layer formed on one side or both sides of the base substrate and including trenches formed in a circuit region and a dummy region positioned at a peripheral edge of the trench substrate, and a circuit layer formed in the trenches of the circuit region through a plating process and including a circuit pattern and vias. Thanks to formation of the trenches in the dummy region and the cutting region, deviation in thickness of a plating layer formed on the insulating layer in a plating process is improved upon.