Flat Panel Display Bezel Reduction via Flexible Wiring Routing
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Solution Overview
Problem
Typical flat panel display apparatuses have an increased peripheral region and bezel size due to the larger area of the first substrate required for wiring and pad units, leading to a significant dead space where images are not displayed.
Innovation Solution
A method involving a lower substrate with a trench in its peripheral area, a first flexible layer, and a sealing member to bond it to an upper substrate, with the first wiring extending outside on the flexible layer, reducing the substrate area discrepancy and bezel size by minimizing the dead space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wiring and pad units are disposed on the first substrate corresponding to the outer side of the second substrate, then electrical signal transfer is enabled, but the peripheral region area and bezel size are increased
Solution Approach 1:
The patent moves the wiring from the planar first substrate to a three-dimensional configuration using a flexible layer that extends vertically and horizontally. The flexible layer is disposed between the first and second substrates, allowing wiring to route signals without occupying additional peripheral area on the first substrate surface, thus reducing bezel size while maintaining electrical connectivity.
Solution Approach 2:
The patent employs a flexible layer as a thin film structure to carry the wiring. This flexible layer can be bent and extended to route electrical signals from the first substrate to the second substrate through the sealing member region, eliminating the need for enlarged peripheral regions on the first substrate and thereby reducing the bezel area.
2Reliability
If the first substrate has a greater area than the second substrate to accommodate wiring and pad units, then electrical connections are established, but the dead space where images are not displayed is increased
Solution Approach 1:
The wiring is routed through a third dimension by using a flexible layer that extends between the substrates rather than spreading out on the first substrate surface. This vertical routing through the sealing member region allows electrical connections to be established without increasing the horizontal footprint, thus minimizing dead space in the display region.
Solution Approach 2:
The wiring is extracted from the first substrate surface and relocated to a flexible layer structure that passes through the sealing member region. This extraction removes the wiring from the peripheral region of the first substrate, preventing the need to enlarge the first substrate area and thereby reducing the dead space where images cannot be displayed.
3Reliability
If wiring is disposed on the peripheral region of the first substrate, then electrical signals can be transferred, but the bezel size is increased
Solution Approach 1:
The flexible layer serves as a thin film conduit that carries wiring through the sealing member region between the first and second substrates. This allows electrical signal transfer to occur through the bezel area rather than requiring additional peripheral region on the first substrate, effectively utilizing the existing bezel space for wiring routing and minimizing visible bezel size.
Solution Approach 2:
The wiring is routed through a vertical dimension by extending the flexible layer between the substrates rather than horizontally on the first substrate surface. This three-dimensional routing allows electrical connections to be made through the sealing member region, eliminating the need to expand the first substrate into the bezel area and thus reducing bezel size.
Data Source
AI summary
A flat panel display apparatus for reducing a bezel size and a method for manufacturing the same. The flat panel display apparatus includes a lower substrate having a display area and a peripheral area surrounding the display area, an upper substrate corresponding to the lower substrate, a sealing member disposed along the peripheral area of the lower substrate and bonding the lower substrate and the upper substrate, a first flexible layer disposed on a surface of the lower substrate in a direction facing the upper substrate, in the peripheral area of the lower substrate, the first flexible layer extending to an outside of the lower substrate, and a first wiring disposed between the lower substrate and the sealing member and extending to the outside of the lower substrate and along the first flexible layer.