3D Power Module Vertical Substrate Heat Dissipation
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Solution Overview
Problem
Traditional power modules with planar structures face challenges in space utilization and heat dissipation efficiency due to the combination of substrate and heat dissipation assemblies, leading to oversized and overweight inverters that fail to achieve high power density and efficient heat management.
Innovation Solution
A three-dimensional power module design featuring substrates arranged around an axis, with power devices electrically connected and a heat dissipation assembly positioned opposite to the devices, allowing for vertical heat transfer and enhanced space utilization, thereby improving both power density and heat dissipation performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a planar structure is used for power modules, then the substrate can bear the power devices, but the heat dissipation assembly occupies excessive space and reduces power density
Solution Approach 1:
The patent transitions from a traditional planar two-dimensional layout to a three-dimensional vertical structure. Multiple substrates are stacked in the vertical direction with power devices arranged on different planes, allowing heat dissipation assemblies to be positioned between or around substrates rather than occupying lateral space. This dimensional change enables compact integration while maintaining effective heat dissipation pathways.
2Temperature
If a planar heat dissipation structure is used, then heat can be dissipated from power devices, but the combination with substrate reduces space utilization efficiency
Solution Approach 1:
The patent integrates the heat dissipation function directly into the substrate structure. Heat dissipation assemblies are combined with substrates in a stacked configuration where thermal interfaces are formed between substrate surfaces and heat dissipation components. This merging eliminates the need for separate planar heat dissipation structures and reduces overall device complexity while improving thermal management efficiency.
3Power
If traditional power module structure is used, then power devices can be mounted, but the inverter becomes oversized and overweight
Solution Approach 1:
The patent employs a nested stacking architecture where power devices, substrates, and heat dissipation assemblies are vertically integrated in a compact tower-like structure. Multiple functional layers are nested within a small footprint volume, with each substrate layer supporting power devices while heat dissipation assemblies are interspersed between substrate layers. This nesting approach achieves high power density without increasing inverter weight.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The three-dimensional structure reduces the area occupied by the power module, enhances heat dissipation efficiency, and allows for easier assembly and repair, while maintaining high power density and reliability, addressing the limitations of traditional planar structures.
Implementation Method 1
Heat generated from the power devices is transferred to the heat dissipation assembly through the substrates
Data Source
AI summary
A power module including a plurality of substrates, a plurality of power devices, and a heat dissipation assembly is provided. The substrates are located on different planes and surround an axis. Each of the substrates extends along the axis. The power devices electrically connected with each other are disposed on the substrates respectively. The heat dissipation assembly is disposed on the substrates and opposite to the power devices. Heat generated from the power devices is transferred to the heat dissipation assembly through the substrates.