Wiring Substrate Electrode Area Variation for Recess Stability

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Solution Overview

Problem

Conventional wiring substrates face challenges in maintaining airtightness and long-term reliability due to deformation of the recesses, particularly when connected to module substrates, as the external electrodes' uneven distribution and size lead to inadequate holding forces, resulting in potential encapsulation or sealing issues.

Innovation Solution

A wiring substrate design featuring a square insulating substrate with a recess and external electrodes arranged in a row, where the center electrodes have a larger area than those at the edges, providing a balanced holding force to suppress recess deformation and enhance airtightness by connecting via solders to a module substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If external electrodes are arranged with larger area at edges for better connection, then connection strength is improved, but recess deformation increases due to unbalanced holding force

Engineering Contradiction:
Improveconnection strengthVSAvoidrecess deformation
Core Design Contradiction:
StrengthVSStability of the object's composition

Solution Approach 1:

The patent applies local quality by differentiating the area of external electrodes based on their position: center electrodes have a larger area than edge electrodes. This localized variation in electrode area creates a balanced holding force distribution that prevents recess deformation while maintaining strong connections. The center electrodes with larger area provide sufficient holding force to counteract deformation, while edge electrodes with smaller area maintain appropriate connection strength without causing unbalanced forces.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent employs asymmetry by intentionally creating unequal areas among external electrodes based on their positions. The center electrodes have a larger area compared to the edge electrodes, forming an asymmetric configuration. This asymmetric design optimizes the holding force distribution across the insulating substrate, ensuring that the recess remains stable and undeformed while maintaining reliable electrical connections.

Inventive Principle:
Principle #4Asymmetry

2Reliability

If external electrodes have larger area for better holding force, then reliability is improved, but manufacturing complexity increases due to varied electrode dimensions

Engineering Contradiction:
Improvelong-term reliabilityVSAvoidelectrode configuration complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent applies segmentation by dividing the external electrodes into distinct groups based on their positions: center electrodes and edge electrodes. Each group has a standardized area dimension, which simplifies the manufacturing process compared to completely custom dimensions for each electrode. This segmented approach with two area specifications (larger for center, smaller for edge) balances reliability requirements with manufacturing feasibility.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent utilizes parameter changes by varying the area parameter of external electrodes based on their position. Instead of using a single uniform area for all electrodes, the area parameter is changed to two discrete values: a larger area for center electrodes and a smaller area for edge electrodes. This controlled parameter variation achieves the desired holding force balance while maintaining manufacturing simplicity through standardized dimension sets.

Inventive Principle:
Principle #35Parameter changes

3Stability of the object's composition

If center electrodes have larger area than edge electrodes, then recess deformation is suppressed, but manufacturing precision requirements increase

Engineering Contradiction:
Improverecess deformation suppressionVSAvoidelectrode area precision
Core Design Contradiction:
Stability of the object's compositionVSManufacturing precision

Solution Approach 1:

The patent applies local quality by assigning different area specifications to electrodes based on their local position requirements. Center electrodes receive larger area dimensions optimized for preventing recess deformation, while edge electrodes receive smaller area dimensions suitable for their connection needs. This localized optimization achieves effective deformation suppression while maintaining reasonable manufacturing precision through position-based standardization.

Inventive Principle:
Principle #3Local quality

Data Source

PatentUS11024554B2Wiring substrate, electronic device, and electronic module
Publication Date: 2021.06.01 KYOCERA CORP
  • US11024554B2 patent drawing
  • US11024554B2 patent drawing
  • US11024554B2 patent drawing

AI summary

A wiring substrate includes an insulating substrate being square in plan view, the insulating substrate including one main surface with a recess, and the other main surface opposite to the one main surface, and external electrodes located on the other main surface of the insulating substrate. The external electrodes are arranged in a row in a peripheral section of the insulating substrate. In plan view, an area of one of the external electrodes located at a center of each side of the insulating substrate is larger than an area of one of the external electrodes located at an edge of the each side.