Compact Camera Module Assembly With Chip Protective Structure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing camera module designs face failures due to a small contact area between the plastic injection mold and the chip, leading to potential cracking and operational failures during plastic injection molding, which is exacerbated by the reduced thickness requirements in modern smartphones.
Innovation Solution
The introduction of a first protective structure in the camera module increases the contact area with the chip, enhancing the force-bearing capacity to withstand pressure from the plastic injection mold, while omitting the camera lens holder to reduce module size, using a combination of flexible circuit boards, image sensors, connection wires, and protective structures to ensure chip safety and module compactness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a lens assembly and image sensor are directly attached to each other, then the assembly process is simple, but foreign matter can be trapped between the components causing imaging defects
Solution Approach 1:
The space between the lens assembly and image sensor is divided into multiple regions by introducing a spacer component. This segmentation prevents foreign matter from being trapped in the bonding interface while maintaining a manageable assembly process. The spacer creates distinct zones that facilitate controlled assembly without direct contact between the lens assembly and image sensor.
Solution Approach 2:
A spacer is introduced as an intermediary component between the lens assembly and image sensor. This mediator prevents direct attachment while eliminating the risk of foreign matter entrapment. The spacer serves as a buffer that maintains proper spacing and enables reliable assembly without compromising imaging quality.
2Reliability
If the distance between the lens assembly and image sensor is increased to prevent foreign matter, then imaging quality improves, but the overall module size increases
Solution Approach 1:
A thin film spacer is used to maintain the necessary distance between the lens assembly and image sensor. This thin film structure provides the required spacing to prevent foreign matter entrapment and ensure imaging quality while minimizing the increase in overall module volume. The thin film design allows for compact camera module dimensions.
3Ease of manufacture
If adhesive is applied to bond the lens assembly and image sensor, then assembly is simplified, but adhesive residue can contaminate the image sensor
Solution Approach 1:
The adhesive bonding process is eliminated by extracting the need for adhesive entirely. The spacer component provides mechanical support and positioning without requiring adhesive application, thereby preventing adhesive residue contamination of the image sensor. This extraction of the adhesive function simplifies the assembly process while maintaining manufacturing precision.
Solution Approach 2:
The spacer acts as an intermediary that eliminates the need for adhesive bonding. By providing a mechanical interface between the lens assembly and image sensor, the spacer removes the harmful adhesive step from the assembly process while maintaining proper component positioning and preventing contamination.
Data Source
Figure 1~3
Figure 4
AI summary
A camera module, a method for assembling the camera module, and a mobile terminal are provided. The camera module includes a flexible circuit board; a chip, stacked on the flexible circuit board; an image sensor, stacked on the chip; a connection wire, where one end of the connection wire is connected to a wiring region of the flexible circuit board, the other end of the connection wire is connected to an interface region of a first surface of the chip, and the first surface is a surface of the chip away from the flexible circuit board; and a first protective structure, arranged on the interface region of the first surface of the chip.