Printed Circuit Manufacture TRIZ Cases

Stretchable conductive ink patterns on compression fabric maintain skin contact and electrical conductivity for accurate long-term physiological monitoring.

A fork terminal clamps yarn conductive wire into a PCB mounting hole, enabling fast solder-free assembly without heat damage.

A soldered conductive flange creates a secure contact-to-trace joint in LCP printed circuits where copper-plated through vias are not feasible.

Heated tooling forms waveform bends in flexible circuits, improving routing and attachment without slit-induced tearing or trace damage.

Limiting deep conductor recesses in a printed wiring board preserves resin adhesion while reducing signal transmission loss.

A chip-side protective structure enlarges mold contact area to prevent cracking during injection molding while keeping smartphone camera modules thin.

Multiple nozzles spaced across and along the print path form continuous or segmented conductor tracks with higher throughput and stable deposition quality.

A particle-free copper ion coating uses local heating to form fine conductive patterns while avoiding printhead clogging and contamination.

A silicone overlayer shields heavily phosphor-loaded LED packages from moisture, reducing color shift and improving long-term lumen stability.

Successive etching of laser-induced flaw chains forms precise glass openings with complex contours, cutting process time for interposers.

Independently moving and rotating solder pots speed PCB soldering while handling dense pin layouts and de-bridging constraints.

Acousto-optic pulse slicing scans one laser pulse across multiple PCB via spots to improve diameter, circularity, and processing speed.

Precise Ag, Cu, Bi, Ni, and Ge balancing raises solder joint strength while preserving wettability and reliability for BGA and QFP packaging.

A tuned Sn-Ag-Cu-Ni-Ge solder composition improves joint shear strength, suppresses fusion failure, and limits Ni leaching.

CNN-based image analysis classifies PCB process phases and identifies tool anomaly states to cut troubleshooting time and downtime.

A vacuum stage between heating chambers removes solder voids, while gas purification limits flux contamination in the chamber and pump.

A multi-axis acousto-optic deflector improves PCB via drilling by enabling precise beam motion, flexible scan patterns, and controlled pulse slicing.

A positioning jig and height control jig press the insulated circuit board onto the cooling surface to limit warping and stabilize bonding.

Pulsed light and shutter timing regulate heat in the soldering region to limit PCB warping and prevent tombstone defects.

Actuated throttle gate and exit wing adjust solder wave flow in real time to reduce bridging, copper dissolution, and manual tuning risk.

Automated throttle gate and exit wing control solder flow and dwell time in wave soldering to reduce bridging defects and manual adjustment.

By aligning actuators along the tape feed path and converting motion for perpendicular cutting, this case reduces solder cutter width.

Imaging and cavity-status detection let the mounter skip empty pockets, improving solder ball pickup reliability and throughput.

A recessed solder carrier transfers uniform particles without sticky layers, reducing residue, shorts, and bump variation on fine-pitch electrodes.

Sequenced laser pulses and side ventilation clear debris and limit heat buildup for precise, uniform hole drilling in thin substrates.

OCT-guided laser ablation exposes monolithic storage PCB key pins without manual sanding, reducing circuit damage, oxidation, and rework.

Staggered holes, dams, and trenches redirect and remove liquefied flux fumes before they can contaminate mounting boards.

High-volatile rosin flux reduces residue and burnt deposits in through-hole soldering irons while maintaining solder flow and scattering control.

A recessed solder particle carrier avoids adhesive residue and foreign substances, enabling stable fine-pitch bump formation without short circuits.

A rectangular laser beam and synchronized mask-stage sweep maintain energy density for precise deep VIA and trench ablation across large substrates.

Optical calibration of solder flux spray adjusts nozzle timing and pressure to keep PCB deposition accurate and reduce defects.

A second low-intensity laser cleans cut PCB surfaces after ablation, removing conductive residues that cause current leakage.

A rotatable fixture bends flexible circuit boards from 0 to 160 degrees, replacing multiple angle-specific test fixtures and cutting cost.

A tuned Sn-Ag-Cu-Bi-Sb-Fe-Co solder balances heat cycle resistance with thermal conductivity for reliable vehicle-mounted ECU joints.

A multi-element Sn-based solder balances heat conductivity, wettability, and heat cycle resistance by suppressing supercooling and controlling precipitates.

Rounded-electrode resistance welding joins thin copper film to thick copper or aluminum conductors without harming sensitive electronic elements.

An MgO interlayer and Mg solid solution bond copper to alumina at lower temperature, limiting ceramic damage, discharge, and migration.

A second laser beam cleans conductive residue from PCB cut surfaces after cutting, preventing current leakage and improving reliability.

Angled airflow and timed cooling intervals limit heat buildup and debris interference during high-precision drilling of thin substrates.

A sliding plate varies solder wave width to control PCB dwell time without split conveyors, improving reliability and solder quality.

Back-reflection sensing adjusts laser pulse width and power during PCB via drilling to keep hole shape consistent across mixed dielectric regions.

Localized hot-bar soldering with a copper-matrix preform forms intermetallic joints that withstand high heat while limiting PCB thermal stress.

Non-contact IR sensing tracks substrate and material temperature at key dispense stations, cutting heat wait time while improving deposition control.

A coumarin and monoamide thixotropic flux suppresses solder paste separation while cutting reflow residue on electronic circuit boards.

Protected carboxyl groups stay inert in storage, then hydrolyze during soldering to remove oxides and keep low connection resistance.

Different laser apertures for copper and insulating layers improve PCB hole shape, reduce voids and peeling, and shorten processing time.

Non-contact IR sensing measures substrate temperature at critical dispense and heating locations to avoid overheating and shorten process time.

Blending high- and low-melting solder powders cuts peak reflow temperature while reducing voiding and preserving joint reliability in harsh heat.

Controlled Ag, Bi, Sb, and Cu ranges tune tin-based solder microstructure for stronger creep resistance and reliable use above 150°C.

Phosphine oxide in flux improves solder wettability on 42 Alloy and Kovar while reducing corrosion and halogen-related hazards.

A polyolefin and water-soluble resin layer bonds directly to metallic foil, improving hole accuracy and drill life without an adhesion layer.

Spatially distributed laser spots and pulse slicing improve PCB via uniformity and precision while limiting heat buildup during ablation.

Dual-edge support structures stabilize heavy computer cards by preventing vibration and wobbling during operation.