Dual Solder Pot Motion for Faster Complex PCB Soldering
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Solution Overview
Problem
Existing point-to-point soldering systems face inefficiencies due to restricted movement and processing speed when dealing with increasingly compact electronic devices with varied solder pin configurations, and the provision of downstream de-bridging gas outlets further limits movement and efficiency.
Innovation Solution
A soldering system featuring two independently movable and rotatable solder pots that can process a single or multiple PCBs simultaneously, allowing for versatile and efficient solder deposition by translating and rotating within a three-dimensional space, with each pot capable of orienting to access solder pins from any direction and utilizing non-wettable nozzles with optional de-bridging gas outlets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple solder pots are used to process multiple solder pins, then the capability to handle complex PCB designs is improved, but the processing speed decreases due to synchronized movement requirements
Solution Approach 1:
The system divides the soldering process into independent operations where each solder pot can work separately on different solder pins without being constrained by synchronized movement. The first solder pot processes a first solder pin while the second solder pot simultaneously processes a second solder pin, eliminating the bottleneck of coordinated motion control.
Solution Approach 2:
The invention introduces independent movement capabilities for each solder pot along multiple axes (X, Y, and Z directions), allowing them to operate in three-dimensional space independently. This dimensional freedom enables simultaneous processing of multiple solder pins at different locations and orientations without requiring synchronized movement.
2Reliability
If a de-bridging gas outlet is provided downstream of the nozzle, then bridging prevention is improved, but movement freedom is restricted
Solution Approach 1:
The system employs separate de-bridging gas outlets for each solder pot, positioned independently according to their respective soldering directions. This segmentation allows each nozzle to have its de-bridging outlet oriented optimally for preventing bridging in its specific operation, without being constrained by the configuration of other solder pots.
Solution Approach 2:
Each solder pot is equipped with locally optimized de-bridging gas outlets positioned and oriented according to its specific soldering task. The de-bridging gas outlets can be arranged at different locations and angles for different solder pots, providing tailored bridging prevention for each soldering direction and configuration.
3Stability of the object's composition
If solder pots are moved together in synchronized fashion, then consistent processing is maintained, but processing efficiency decreases
Solution Approach 1:
The system transitions from static synchronized movement to dynamic independent movement, where each solder pot can adjust its position, speed, and orientation independently based on real-time processing requirements. This dynamic capability maintains processing consistency through independent control while dramatically improving efficiency by eliminating synchronized movement constraints.
4Reliability
If the nozzle assembly approaches solder pin from a side away from de-bridging gas outlet, then bridging prevention is maintained, but movement is restricted
Solution Approach 1:
Each solder pot is designed as a universal module with independently adjustable de-bridging gas outlets that can be positioned and oriented to handle various soldering scenarios. This multi-functionality allows the system to approach solder pins from any direction while maintaining effective bridging prevention, as each nozzle can configure its de-bridging outlet according to its specific approach direction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances processing efficiency and versatility by enabling simultaneous and efficient soldering of complex PCB designs with varied solder pin arrangements, improving speed and adaptability.
Implementation Method 1
The de-bridging fluid may comprise a jet of nitrogen heated to a temperature above the liquidus temperature of the solder
Data Source
AI summary
A soldering system for processing at least one printed circuit board. The system comprises a first solder pot and a second solder pot, each configured to move within a movement plane. At least one of the first solder pot and the second solder pot is further configured to rotate about a solder pot axis extending transverse to the movement plane. The first solder pot and the second solder pot can be moved relative to the at least one printed circuit board, and at least one of the first solder pot and the second solder pot can be rotated about its solder pot axis relative to the at least one printed circuit board, to simultaneously process the at least one printed circuit board using both solder pots. The soldering system may thus be used to process either a single printed circuit board with both solder pots simultaneously or a pair of printed circuit boards simultaneously with each solder pot processing one of the pair of printed circuit boards. A corresponding soldering method is also disclosed.