Semiconductor Bonding Jig Set for Thermal Warping Control
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Solution Overview
Problem
Existing methods for manufacturing semiconductor devices face challenges in accurately positioning and bonding semiconductor chips to circuit boards and heat dissipating plates, often resulting in inconsistent bonding quality and potential warping due to thermal expansion differences.
Innovation Solution
A method involving a jig set comprising a positioning jig and a height control jig is used to precisely position and bond semiconductor chips to a cooling unit, utilizing a height control weight to manage thermal expansion and ensure consistent bonding by pressing the circuit board against the cooling surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a positioning jig is used to bond the insulated circuit board to the cooling unit, then positioning accuracy is improved, but thermal warping due to expansion differences still occurs
Solution Approach 1:
The positioning jig is divided into a first positioning jig for positioning the insulated circuit board and a second positioning jig for positioning the cooling unit. This segmentation allows independent optimization of each component's positioning function and enables better management of thermal expansion effects by separating the positioning responsibilities.
Solution Approach 2:
The patent introduces a height control weight that adjusts the pressing force applied to the insulated circuit board during bonding. By changing the pressure parameter dynamically, the system compensates for thermal warping effects and ensures consistent bonding quality despite thermal expansion differences between materials.
2Strength
If pressure is applied to bond the insulated circuit board to the cooling unit, then bonding strength is improved, but warping increases due to thermal expansion differences
Solution Approach 1:
The height control weight allows precise control of the pressing force parameter. By optimizing this parameter, the system achieves sufficient bonding strength while minimizing the pressure-induced warping that occurs during the bonding process.
Solution Approach 2:
The positioning jigs are designed to pre-compensate for expected thermal warping by positioning components in a way that anticipates and counteracts the deformation that will occur during heating and bonding operations.
3Stability of the object's composition
If the positioning jig covers the entire insulated circuit board, then positioning stability is improved, but the jig size increases
Solution Approach 1:
By separating the positioning function into two distinct jigs (first positioning jig for the circuit board, second positioning jig for the cooling unit), each jig only needs to cover the specific component it positions rather than the entire assembly, thereby reducing the size of individual jigs while maintaining positioning stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the accuracy and reliability of the bonding process, reducing warping and ensuring consistent electrical connections while improving thermal management in semiconductor devices.
Implementation Method 1
often resulting in inconsistent bonding quality and potential warping due to thermal expansion differences
Data Source
AI summary
A jig set for placing an insulated circuit board on a cooling surface of a cooling unit, and a method for placing the insulated circuit board on the cooling surface using the jet set. The jig set includes: a positioning jig configured to be disposed on the cooling surface, and having an opening corresponding to a size of the insulated circuit board in a plan view, to thereby define a fixing area for housing the insulated circuit board therein; a height control jig including a control part shaped to be fitted into the fixing area of the positioning jig, the control part having, at a lower end thereof, a pressing surface for pressing an upper surface of the insulated circuit board located in the fixing area toward the cooling surface; and a positioning weight configured to apply, to the positioning jig, a pressure toward the cooling surface.