Copper Ion Circuit Printing Without Nozzle Clogging
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Solution Overview
Problem
Current printed circuit board fabrication processes are highly contaminating, and the slurry used for copper circuit fabrication often contains metal particles that limit conductivity and clog print head nozzles, making precision printing difficult.
Innovation Solution
A particle-free copper ion solution comprising copper (II) ions, L-ascorbic acid, and water is applied to a substrate, where a heat source induces the reduction of copper ions to form conductive patterns with excellent electrical conductivity, avoiding the use of surfactants and nanoparticles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal particle slurry is used for copper circuit fabrication, then the circuit can be formed, but the metal particles clog the print head nozzle and limit conductivity
Solution Approach 1:
The invention changes the physical state of copper from solid particles to ionic form in solution. The copper ion solution contains copper ions that can be deposited through thermal decomposition, eliminating particle clogging while maintaining conductivity. The solution undergoes parameter change from liquid solution to solid copper pattern through controlled heating.
Solution Approach 2:
The invention replaces the mechanical particle-based deposition system with a chemical/thermal decomposition system. Instead of mechanically depositing metal particles that clog nozzles, the process uses thermal decomposition of copper ions in solution to form conductive copper patterns, substituting mechanical delivery with chemical transformation.
2Ease of manufacture
If conventional fabrication processes are used, then copper circuits can be formed, but the process is highly contaminating
Solution Approach 1:
The invention extracts and eliminates harmful components from the fabrication process. By using a copper ion solution without surfactants, binders, or toxic chemicals, the process removes contaminating substances while retaining the essential function of copper circuit formation. The decomposition products are primarily water and carbon dioxide, which are environmentally benign.
Solution Approach 2:
The invention changes the chemical composition parameters of the fabrication process from conventional particle slurry containing surfactants and binders to a clean copper ion solution. This parameter change eliminates harmful contaminants while maintaining the ability to form conductive copper circuits through thermal decomposition.
3Reliability
If particle-based slurry is used, then copper patterns can be formed, but the electrical conductivity is limited
Solution Approach 1:
The invention changes the fundamental parameter of copper delivery from solid particles to ionic solution. The copper ion solution provides superior electrical conductivity because the deposited copper forms continuous, dense patterns without the voids and discontinuities inherent in particle-based methods. The simplicity of the ionic solution composition enhances both conductivity and process reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the fabrication of fine copper circuits with low resistance values, preventing nozzle clogging and maintaining high conductivity, suitable for flexible electronic products and low-temperature processes, while being environmentally friendly.
Implementation Method 1
react copper ions in the coating layer to form copper conductive patterns
Implementation Method 2
A heat source is provided to locally heat the coating layer
Data Source
AI summary
Provided is a method of fabricating an electronic circuit including providing a copper ion solution. The copper ion solution includes a source of copper (II) ions, L-ascorbic acid, and water. The copper ion solution is applied on a substrate to form a coating layer. A heat source is provided to locally heat the coating layer to react copper ions in the coating layer to form copper conductive patterns.