Laser Substrate Drilling with Angled Airflow and Cooling Intervals
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Solution Overview
Problem
High-precision laser machining of substrates such as crystalline silicon (c-Si) and polymer composite substrates faces challenges due to localized heating and debris generation, leading to reduced precision and efficiency in drilling processes, especially when processing thin and fragile substrates.
Innovation Solution
An apparatus and method utilizing a laser system with controlled laser beam movement and ventilation system to direct a fluid flow along the substrate, ensuring the laser beam is applied in multiple directions with cooling periods between exposures, and the fluid flow direction is angled relative to the laser beam movement to prevent debris interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high laser energy is applied to achieve high processing volume and high accuracy, then drilling efficiency is improved, but localized heating and melting occur reducing precision
Solution Approach 1:
The laser beam is applied in periodic pulses rather than continuous exposure. The patent specifies that at least half of the subjected areas are allowed to cool for at least 50 ms after each laser exposure. This periodic action allows the substrate to dissipate heat between pulses, preventing localized melting while maintaining high drilling efficiency through cumulative material removal over multiple pulses.
Solution Approach 2:
A ventilation system is activated before and during laser exposure to establish fluid flow along the substrate surface. This preliminary action ensures that cooling fluid and debris removal are in place before the laser begins machining, preventing heat accumulation and debris interference from the outset, thereby maintaining both precision and efficiency.
2Productivity
If continuous laser exposure is used to maintain high processing speed, then productivity is improved, but debris generation increases disturbing the process
Solution Approach 1:
A ventilation system using fluid flow (gas or liquid) is employed to remove debris generated during laser drilling. The fluid flow is directed along the substrate surface at specific angles relative to the laser beam movement, creating a pneumatic/hydraulic cleaning effect that continuously clears debris from the processing area without interrupting the high-speed continuous laser exposure.
Solution Approach 2:
The ventilation fluid acts as an intermediary between the laser processing zone and the surrounding environment. It mediates the removal of harmful debris particles generated by laser-material interaction, transporting them away from the processing area while allowing the laser to continue operating at high speed without interruption.
3Productivity
If high laser energy is applied to process thin substrates quickly, then processing efficiency is improved, but substrate damage and breakage increase
Solution Approach 1:
The laser is applied in periodic pulses with cooling intervals of at least 50 ms between exposures to at least half of the subjected areas. This periodic action allows thin substrates to dissipate heat between pulses, preventing thermal stress accumulation that could cause breakage, while still achieving efficient material removal through cumulative exposure over multiple pulses.
Solution Approach 2:
The ventilation system is activated in advance to establish fluid flow along the substrate surface before laser exposure begins. This preliminary cooling and debris removal preparation prevents thermal shock and debris-induced damage to thin substrates during the high-efficiency laser processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances precision and efficiency by preventing localized heating and debris interference, allowing for high-speed, high-precision drilling of substrates with improved uniformity and reduced damage to thin and fragile materials.
Implementation Method 1
a laser system configured to apply a laser beam onto the substrate for removing material from a set of areas on the substrate
Implementation Method 2
The laser beam removes material from the set of areas
Implementation Method 3
a ventilation system configured to produce a fluid flow along one or more sides of the substrate. The fluid flow is directed in a fluid flow direction
Data Source
AI summary
An apparatus for hole drilling in a substrate is provided. The apparatus includes a laser system configured to apply a laser beam onto the substrate for removing material from a set of areas on the substrate by directing the laser beam onto predefined positions corresponding to the set of areas on the substrate in a sequence. The apparatus includes a ventilation system configured to produce a fluid flow along one or more sides of the substrate. The apparatus controls the laser beam such that the laser beam is sequentially positioned according to a first laser beam movement direction and a second laser beam movement direction.