Wave Soldering Nozzle Assembly for Dynamic Solder Flow Control
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Solution Overview
Problem
Existing wave soldering machines face challenges in controlling the flow of solder, which can lead to defects such as solder bridging and copper dissolution, and require manual adjustments that are risky and inefficient.
Innovation Solution
A wave soldering machine with a nozzle assembly featuring a throttle gate and an exit wing, controlled by actuators, to adjust solder flow dynamically, optimizing dwell time and velocity matching to reduce defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If manual adjustment of solder flow is performed by operators, then the solder flow can be adjusted, but the risk to operators increases and the process becomes inefficient
Solution Approach 1:
The system uses sensors to automatically detect solder flow conditions and actuators to adjust the nozzle position and flow rate without human intervention. The controller autonomously maintains optimal solder flow parameters based on real-time feedback from sensors, eliminating the need for operators to manually adjust settings in the hazardous molten solder environment.
2Quantity of substance
If solder flow is increased to improve soldering coverage, then more areas are covered, but solder bridging and copper dissolution defects increase
Solution Approach 1:
Sensors continuously monitor solder flow rate, wave height, and temperature, feeding this data to the controller. The controller dynamically adjusts the throttle gate position and nozzle parameters to maintain optimal solder flow quantity, preventing both insufficient coverage and excessive flow that causes bridging and copper dissolution defects.
Solution Approach 2:
The system dynamically adjusts solder flow parameters in real-time based on processing conditions. The actuators modify nozzle position, tilt angle, and throttle gate opening to optimize solder flow quantity for different PCB configurations, ensuring adequate coverage without causing defects.
3Manufacturing precision
If solder flow is decreased to reduce defects, then solder bridging and copper dissolution are reduced, but soldering coverage becomes insufficient
Solution Approach 1:
The system applies different solder flow rates to different regions of the PCB based on local requirements. Sensors detect areas requiring more solder and direct increased flow to those specific zones while maintaining lower flow in areas that don't require it, achieving both adequate coverage and defect prevention through spatially differentiated flow control.
Data Source
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AI summary
The present application relates to a wave soldering station includes a solder pot (30) having a reservoir (32) of solder material, a flow duct (34) positioned in the reservoir (32) of the solder pot (30), and a wave soldering nozzle assembly (36) coupled to the flow duct (34). The wave soldering nozzle assembly (36) has a solder distribution baffle configured to create a solder wave, a throttle gate (72) coupled to the flow duct (34) and configured to move from an open position to enable complete flow of solder through the solder distribution baffle and a closed position to inhibit a portion of flow of solder through the solder distribution baffle, and an exit wing (50) coupled to the flow duct (34) and configured to move from a lowered position to enable increased solder flow and a raised position to decrease solder flow. A controller is configured to control the movement of the throttle gate (72) and the exit wing (50) to control the flow of solder.