LCP Printed Circuit Contact Joint Without Plated Through Vias
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Solution Overview
Problem
Providing conductive paths that form reliable and secure electrical connections between electronic components in electronic devices is challenging, particularly in devices with flexible printed circuits that do not support copper-plated through vias.
Innovation Solution
A flexible printed circuit with a conductive trace and a conductive flange is used, where the flange extends into a hole with a gap, and a conductive contact is inserted into the central opening with solder deposited over the flange to ensure a robust mechanical and electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper-plated through vias are used to couple conductive traces to conductive contacts, then reliable electrical connections are achieved, but LCP flexible printed circuits cannot support this method
Solution Approach 1:
A conductive flange acts as an intermediary component between the conductive trace and conductive contact. The flange is soldered to the conductive trace and extends into the hole to laterally surround the central opening, providing a mechanical and electrical connection that works with LCP flexible printed circuits without requiring copper plating of the via itself
Solution Approach 2:
The connection structure is segmented into distinct functional parts: a conductive flange for soldering to the trace, a portion extending into the hole for mechanical support and electrical connection, and a configuration that laterally surrounds the central opening. This segmentation allows each part to perform its specific function effectively
2Ease of manufacture
If conventional through-via methods are used, then simple manufacturing is achieved, but secure mechanical and electrical connections cannot be ensured with LCP materials
Solution Approach 1:
The conductive flange is pre-formed with specific geometry (extending into the hole and laterally surrounding the central opening) before assembly. This preliminary preparation ensures that when solder is deposited, the flange is already positioned to provide both mechanical support and electrical connection, achieving reliable results without complex manufacturing steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures a reliable mechanical and electrical connection between the conductive contact and the conductive trace, even in devices with LCP flexible printed circuits, supporting secure coupling to components like antenna grounds and speaker drivers.
Implementation Method 1
Solder may be deposited over the conductive flange and in the central opening. The solder may couple the conductive contact to the conductive flange and thus the conductive trace.
Data Source
AI summary
An electronic device may be provided with a liquid crystal polymer (LCP) printed circuit having conductive trace and a hole. A conductive flange may be soldered to the conductive trace and may extend into the hole. The end of the conductive flange may laterally surround a central opening within the hole. A conductive contact may be inserted into the central opening. Solder may be deposited over the conductive flange and in the central opening. The solder may couple the conductive contact to the conductive flange and thus the conductive trace. This may ensure a robust mechanical and electrical connection between the conductive contact and the conductive trace on the printed circuit despite the printed circuit being formed from LCP, which may not support copper-plated through vias for coupling to the conductive contact.