Wave Solder Nozzle Assembly for Automated Flow and Dwell Control
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Solution Overview
Problem
Existing wave soldering machines face challenges in controlling solder flow, which can lead to defects like solder bridging and require manual adjustments, posing risks to operators and inefficiencies.
Innovation Solution
A wave soldering machine with a nozzle assembly featuring a solder distribution baffle, throttle gate, and exit wing, controlled by actuators and a controller, allows for automated adjustment of solder flow to optimize dwell time and velocity matching, reducing defects and operator intervention.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If manual adjustment of solder flow is performed, then operator control over soldering process is achieved, but operator safety is compromised and adjustment precision is reduced
Solution Approach 1:
The patent replaces manual mechanical adjustment with an automated control system that uses sensors to detect solder flow parameters and actuators to adjust the nozzle assembly automatically. This eliminates the need for operators to physically intervene in the solder pot, resolving the safety issue while maintaining control through automated feedback loops.
Solution Approach 2:
The system enables self-adjustment of solder flow parameters through automated sensing and actuation mechanisms. The nozzle assembly automatically adjusts its position and configuration based on real-time feedback from sensors, eliminating dependence on manual operator intervention while maintaining optimal soldering conditions.
2Ease of operation
If manual adjustment of solder flow is performed, then operator control over soldering process is achieved, but production efficiency is reduced
Solution Approach 1:
The automated control system enables continuous monitoring and adjustment of solder flow parameters without interruption to the soldering process. Sensors continuously detect flow conditions and actuators make real-time adjustments, eliminating the downtime associated with manual intervention and maintaining continuous production flow.
Solution Approach 2:
By replacing manual adjustment mechanisms with automated sensors and actuators, the system eliminates the time required for operators to physically adjust solder flow parameters. This automation enables faster response times and continuous operation, significantly improving production efficiency.
3Manufacturing precision
If solder flow is increased to improve soldering coverage, then soldering quality is improved, but solder bridging defects increase
Solution Approach 1:
The patent implements a feedback control system where sensors monitor solder flow parameters and provide real-time data to the control system. Based on this feedback, the system automatically adjusts the nozzle position and flow rate to maintain optimal soldering conditions, preventing both insufficient coverage and excessive flow that causes bridging defects.
Solution Approach 2:
The system dynamically adjusts solder flow parameters based on real-time conditions rather than using fixed settings. The automated control system modifies flow rate, nozzle position, and other parameters on-the-fly to optimize soldering quality for each specific situation, preventing solder bridging while ensuring adequate coverage.
4Manufacturing precision
If complex nozzle assembly is used to control solder flow, then soldering precision is improved, but device complexity increases
Solution Approach 1:
The patent designs the nozzle assembly with multi-functional components that perform multiple tasks simultaneously. For example, the nozzle structure integrates flow control, positioning, and sensing capabilities into unified components, reducing the number of separate parts needed while maintaining precise soldering control.
Solution Approach 2:
The system merges several control functions into integrated components. The nozzle assembly combines flow regulation, positional adjustment, and feedback sensing into a unified structure, reducing overall system complexity while maintaining the precision required for high-quality soldering.
Data Source
AI summary
A wave soldering station includes a solder pot having a reservoir of solder material, a flow duct positioned in the reservoir of the solder pot, and a wave soldering nozzle assembly coupled to the flow duct. The wave soldering nozzle assembly has a solder distribution baffle configured to create a solder wave, a throttle gate coupled to the flow duct and configured to move from an open position to enable complete flow of solder through the solder distribution baffle and a closed position to inhibit a portion of flow of solder through the solder distribution baffle, and an exit wing coupled to the flow duct and configured to move from a lowered position to enable increased solder flow and a raised position to decrease solder flow. A controller is configured to control the movement of the throttle gate and the exit wing to control the flow of solder.