Glass Opening Etching with Flaw Chains for Precise Interposers

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Solution Overview

Problem

Existing methods for creating openings in thin glass workpieces, such as interposers, are elaborate and inefficient, particularly in forming multiple openings with precise contours and structures.

Innovation Solution

A method involving laser-induced flaws followed by anisotropic etching to create a sequence of cross-sectional widenings and constrictions, forming a recess or opening with an 'earthworm structure', allowing for rapid and precise production of openings with concentric peripheral microstructures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If athermal destruction followed by channel widening is used to create openings in glass workpieces, then openings can be formed, but the process becomes elaborate and time-consuming

Engineering Contradiction:
Improveopening formationVSAvoidprocess complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent segments the opening formation process into discrete etching steps, where individual flaws are etched separately and then joined together. This allows precise control over the opening contour and eliminates the need for athermal destruction followed by channel widening, thereby reducing process complexity while maintaining manufacturing precision.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent creates a chain of flaws as preliminary structures before final etching. These pre-positioned flaws serve as templates for the opening contours, enabling direct etching of complex shapes without requiring multiple process steps like athermal destruction and subsequent widening, thus simplifying the overall process.

Inventive Principle:
Principle #10Preliminary action

2Manufacturing precision

If conventional laser processing with pico- and femtosecond pulses is used, then material can be processed, but the laser beam requires strong focusing which limits flexibility

Engineering Contradiction:
Improvematerial processing precisionVSAvoidbeam focusing flexibility
Core Design Contradiction:
Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The patent changes the laser pulse duration parameter from pico- and femtosecond range to nanosecond range (specifically 1-100 ns). This parameter change allows the laser beam to process material without requiring strong focusing, thereby maintaining manufacturing precision while significantly improving beam flexibility and adaptability for creating complex flaw chains.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent uses periodic laser pulsing to create sequences of flaws along a desired contour. By controlling the pulse repetition rate and positioning, multiple flaws are created in a systematic pattern that forms the basis for the final opening shape, providing both precision and flexibility in contour design.

Inventive Principle:
Principle #19Periodic action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables efficient and cost-effective production of openings in glass workpieces with complex contours, suitable for interposer applications, reducing processing time and enhancing adhesion of metal layers.

Implementation Method 1

the glass workpiece is irradiated with focused laser pulses, the radiation intensity of which is so high that local athermal destruction occurs along a channel in the glass

Methodology Applied
Scientific EffectOptical breakdown: Laser Ablation

Implementation Method 2

successively etching a plurality of flaws to form the recess or opening

Methodology Applied
Scientific EffectChemical etching: Chemical Bonding

Data Source

PatentUS12604743B2Method for making a recess or opening into a planar workpiece using successive etching
Publication Date: 2026.04.14 LPKF LASER & ELECTRONICS AG
  • US12604743B2 patent drawing
  • US12604743B2 patent drawing
  • US12604743B2 patent drawing

AI summary

A method for making a recess or opening in a planar workpiece with a thickness of less than 3 millimeters includes successively etching a plurality of flaws to form the recess or opening such that a contour of the recess or opening has a sequence of widenings and constrictions as a result of the etching.