PCB Insulating Layer Removal Using OCT-Guided Laser Ablation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing manual sanding method for removing the surface insulating layer of a printed circuit board in monolithic storage devices is prone to damaging the circuit, leads to copper oxidation, and is time-consuming and labor-intensive.
Innovation Solution
A method and system utilizing an optical coherence tomography device to obtain three-dimensional tomographic spectrum data, which is then used by a control device to determine the circuit structure and key pin positions. A laser etcher, controlled by the system, ablates the insulating layer covering the key pin positions, allowing for precise and automated removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If manual sanding is used to remove the insulating layer, then the insulating layer can be removed to expose the circuit, but the risk of damage to the circuit increases and copper oxidation occurs
Solution Approach 1:
The patent replaces the manual mechanical sanding process with an automated laser ablation system. The laser precisely removes the insulating layer through optical energy without mechanical contact, eliminating the risk of circuit damage associated with manual sanding while maintaining effective insulating layer removal.
Solution Approach 2:
The patent implements an inert gas protection mechanism during the laser ablation process. The inert atmosphere prevents copper oxidation that would otherwise occur when the circuit board is exposed to air during the insulating layer removal process, thereby preserving circuit integrity.
2Ease of manufacture
If manual sanding is used to remove the insulating layer, then the insulating layer can be removed, but the process is time-consuming and labor-intensive
Solution Approach 1:
The patent replaces manual sanding with an automated laser ablation system controlled by computer software. This automation eliminates manual labor and significantly reduces processing time, as the laser can precisely remove the insulating layer much faster than manual sanding while being fully controllable through automated positioning systems.
Solution Approach 2:
The patent employs preliminary imaging and circuit analysis to automatically identify the exact locations requiring insulating layer removal. This pre-positioning allows the laser system to directly target only the necessary areas without trial and error, minimizing processing time and ensuring precise removal only where needed.
3Ease of operation
If the entire insulating layer is removed by manual sanding, then the circuit structure can be identified, but the breakdown of the monolithic storage device increases
Solution Approach 1:
The patent applies local quality by removing the insulating layer only at specific key pin positions rather than the entire surface. The system identifies and targets only the necessary contact areas for data recovery, leaving the rest of the insulating layer intact to protect the circuit board and maintain device integrity.
Solution Approach 2:
The patent uses laser ablation with precise digital control to remove insulating layer only where needed. The automated system can precisely target and remove material at specific coordinates, providing the circuit identification capability needed while minimizing overall material removal and protecting unnecessary areas from damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the risk of damaging internal circuits, minimizes the breakdown of the monolithic storage device, simplifies the data recovery process, and enhances the efficiency of insulating layer removal.
Implementation Method 1
obtaining three-dimensional tomographic spectrum data of the printed circuit board
Implementation Method 2
optical coherence tomography device
Implementation Method 3
controlling a laser etcher to ablate an insulating layer covering the key pin position
Implementation Method 4
laser etcher
Data Source
AI summary
The present application provides a method and a system for removing a surface insulating layer of a printed circuit board of a monolithic storage device, and relates to the field of electronic data forensics technologies. The method includes: receiving three-dimensional tomographic spectrum data of the printed circuit board sent by an optical coherence tomography device, and determining a circuit structure image of the printed circuit board according to the three-dimensional tomographic spectrum data; determining at least one key pin position according to the circuit structure image, the key pin position being a pin position corresponding to a memory chip in the printed circuit board; and controlling, in accordance with each key pin position, a laser etcher to ablate an insulating layer covering the key pin position.