Camera Module Connecting Assembly for Nondestructive PCB Conductivity Check
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Solution Overview
Problem
Existing methods for testing the conductivity between printed circuit boards (PCBs) during electronic device production are destructive and cannot be applied to all products, leading to potential defects.
Innovation Solution
A connecting assembly that includes a substrate, a connection board, a layer of conductive adhesive with multiple conductive particles, and a light transmission component. The light transmission component allows for nondestructive observation of the conductive particles, determining the establishment of an electric conductive connection between the connection board and the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a destructive conductivity test is performed to ensure connection reliability, then the reliability of the conductive connection is improved, but all products cannot be tested and defects remain in some products
Solution Approach 1:
The patent replaces the traditional destructive mechanical testing method with an optical inspection method. Light transmits through the conductive adhesive layer to illuminate conductive particles, allowing non-destructive visualization and inspection of the conductive connection quality through the substrate, enabling 100% testing coverage while maintaining reliability assessment.
Solution Approach 2:
The patent introduces a light transmission component as an intermediary element that allows light to pass through the substrate and conductive adhesive layer. This intermediary enables the inspection system to observe conductive particles without direct contact or destruction of the connection, resolving the contradiction between non-destructive testing and reliable detection.
2Productivity
If a nondestructive test method is used to test all products, then productivity and testing coverage are improved, but the ability to accurately detect conductivity defects may be compromised
Solution Approach 1:
The patent utilizes optical properties where light interacts with conductive particles in the adhesive layer, causing observable changes in light transmission and reflection. By analyzing these optical changes, the system can accurately detect the presence and state of conductive particles without physical contact, maintaining measurement precision while enabling nondestructive testing of all products.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables a nondestructive conductivity test, allowing for the observation of conductive particles and determining the effectiveness of the conductive connection, thereby ensuring product quality and avoiding defects.
Implementation Method 1
The light transmission component is configured for transmitting light, the light enters the layer of conductive adhesive via the light transmission component
Data Source
AI summary
A connecting assembly comprises a substrate, a layer of conductive adhesive with conductive particles, a connection board, and a light transmission component. The connection board and the light transmission component are both glued to the substrate by the layer of conductive adhesive therebetween, and an operator can observe the a degree of deformation of the conductive particles in the layer of conductive adhesive to determine whether a conductive connection between the light transmission component and the substrate is affected. The connecting assembly allows an operator to effectively observe conductivity of every product in a nondestructive manner. A camera module comprising the connecting assembly and an electronic device are also disclosed.