Circuit Optical Details TRIZ Cases

Embedded optical fiber, a lens, and a reflective blind hole cut RF transmission loss while keeping the circuit board lightweight and bendable.

Fe+3 etching selectively patterns copper and nickel traces while protecting silver nanowire conductive films in narrow-bezel touch sensors.

Automatic gripper alignment and laser soldering mount a surface optical module in tight spaces while cutting signal loss and easing replacement.

Grounded shielding electrodes between adjacent display antennas block surface waves, improving wireless transmission and reception efficiency.

Through-silicon vias and backside metallization ground stacked PIC shields to suppress Z-direction crosstalk and protect photodetectors.

Substrate extensions carry electrical and optical I/O outside the base substrate to raise connection density while cutting routing loss, power, and latency.

A shielding signal line between pad groups discharges static charge on Mini and Micro LED substrates to prevent sub-pad breakdown and improve yield.

Apertures in an OLED display and a matching transparent metasurface enable high-gain RF beam steering without consuming extra antenna area.

A deep trench conductive path preserves transparency and conductivity while reducing resin-layer delamination under temperature changes.

Air-gapped multilayer films protect LEDs and traces from injection pressure while enabling separate testing, tighter packaging, and lower waste.

Coplanar or stacked optical and conductive trace layers enable dense hybrid packaging with simpler heterogeneous integration and reliable chip interconnects.

Divided antistatic pads around an insulating dome protect densely packed backlight LEDs from static damage without using Zener diodes.

Substrate extensions carry electrical and optical links outside the base substrate, boosting interconnect density while cutting routing loss and package complexity.

A conductive link between the driving assembly and PCB supports compact lens actuation with higher reliability, stronger drive force, and less magnetic interference.

An air gap between transmissive layers boosts luminance while a non-overlapping spacer shields LED elements from dust and stray reflections.

A glass-filled via cavity forms an optical waveguide in the PCB, improving transparency and enabling faster interlayer signal transmission.

A display PCB placed between the module and protective film improves pad connection durability while shielding against impact and aiding heat dissipation.

Controlled chemiluminescence in a cured cyclic olefin insulator helps wiring boards retain dielectric stability during high-temperature aging.

Multiple side landing areas keep electrical path lengths equal across chip orientations, cutting PCB variants and avoiding collisions.

A stepped circuit board and wide transparent substrate shrink image sensor packages while protecting terminals and maintaining light transfer.

Convex-concave resin surfaces and reflective layers spread LED output into a uniform line light source with fewer hot spots.

Embedding an antenna pattern inside resin and reflective layers adds communication to a vehicle lamp without extra antenna space or exposed-part degradation.

Integrated molding aligns dual photosensitive units and seals wires to improve imaging uniformity, rigidity, and module thinness.

Stacked transparent core layers with overlapping sub-through holes and a buffer layer improve substrate stiffness and reduce RDL warpage.

Dummy via patterns balance substrate stress to prevent warping while preserving electrical insulation in electronic packaging.

An epoxy via frame with conductive filled holes shortens optical transceiver interconnects to preserve signal integrity at high data rates.

A flexible twisted LED filament solves poor single-sided light distribution, delivering omnidirectional output with fewer added structures.

Windowed reflective layers expose LED bonding pads while boosting reflectivity, improving die bonding, lighting effect, yield, and cost.

A dual reflective layer with window structures improves LED die bonding, light distribution, process yield, and manufacturing cost.

An enclosed electro-optic modulator mounts on a PCB to preserve beam control while shrinking laser system size and easing electronic integration.

A two-layer organic insulating film layout cuts light scattering and outgas generation while preserving luminance in LED displays.

Convex-concave resin optics and reflective layers spread LED output into a wider, more uniform emitting area while reducing hot spots.

Opposite-side component placement in a sealed optical path supports liquid cooling, high data rates, and compact optical interconnect integration.

Dummy via patterns balance substrate stress in fan-out packaging, limiting warpage while preserving electrical isolation and yield.

Transparent and thermally conductive board regions let LED modules dissipate heat while preserving optical alignment and uniform light output.

By embedding an antenna pattern between the reflector and substrate, the lamp adds NFC communication without a separate antenna or major space penalty.

A transparent laminating film transfers conductive metal patterns into glass to cut reflectivity and make antennas less visible.

A light-transmission path reveals conductive particle deformation, enabling nondestructive PCB connection checks across every camera module.

A stepped wiring board uses exposed and overlapping pad regions to shrink hermetic light-emitting devices while keeping connections reliable.

Separation structures keep soldering material away from adhesive in an optical package cap assembly, preventing shorts and saving substrate area.

A support member shields lead wires during molding, preserving sensor-to-board alignment for smaller image modules with fewer defects.

Antistatic pads around LED backlight sources route electrostatic discharge to ground without Zener diodes, protecting image quality.

A mold-sealed photosensitive assembly encloses wires and chips to control alignment, reduce dust contamination, and slim dual-camera modules.

Spaced reflective patterns and layer hollows relieve tensile stress in circuit boards, reducing warpage and improving connection reliability.

A split antistatic pad and insulating dome protect densely packed backlight LEDs from static damage without adding Zener diodes.

A phosphor layer converts LED excitation light to a different visible color, reducing glare and chromaticity variation without separate optics.

Adhesive bonding replaces solder in this sensor lens assembly, lowering heat-resistance demands, simplifying packaging, and supporting smaller sensor chips.

A recessed carrier and vertical interconnect layout shrink optoelectronic package area, shorten electrical paths, and improve yield and signal integrity.

A cavity backplane with copper power and ground layers improves micro-LED contact precision, cuts voltage drop, and reduces visible seams.

Conductive strands and in-process insertion embed electronics into fabric, protecting signal paths and keeping components attached during flexing.

A twisted flexible LED filament creates 3D light distribution, improving omnidirectional output without extra filaments or transparent substrates.

Insulated protrusions and bridging members replace optical adhesive and a separate cover lens, yielding thinner touch panels with higher transmittance.

A masking layer defines metal conductive electrodes for touch screens, preventing side etching and oxidation while increasing yield rates.