Embedded optical fiber, a lens, and a reflective blind hole cut RF transmission loss while keeping the circuit board lightweight and bendable.
Fe+3 etching selectively patterns copper and nickel traces while protecting silver nanowire conductive films in narrow-bezel touch sensors.
Automatic gripper alignment and laser soldering mount a surface optical module in tight spaces while cutting signal loss and easing replacement.
Grounded shielding electrodes between adjacent display antennas block surface waves, improving wireless transmission and reception efficiency.
Through-silicon vias and backside metallization ground stacked PIC shields to suppress Z-direction crosstalk and protect photodetectors.
Substrate extensions carry electrical and optical I/O outside the base substrate to raise connection density while cutting routing loss, power, and latency.
A shielding signal line between pad groups discharges static charge on Mini and Micro LED substrates to prevent sub-pad breakdown and improve yield.
Apertures in an OLED display and a matching transparent metasurface enable high-gain RF beam steering without consuming extra antenna area.