Capacitive Touch Panel Layout Without Optical Adhesive

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Solution Overview

Problem

Conventional capacitance touch panel modules are overly thick, resulting in suboptimal light transmittance and reduced quality, and rely on expensive and non-recyclable optical adhesives.

Innovation Solution

A method of fabricating a capacitance touch panel module that eliminates the need for a protective lens by forming a substrate with conductive patterns and insulated protrusions, using lithography or photo etching to create a structure that enhances light transmittance without requiring optical adhesives.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional capacitance touch panel module uses a base plate, two transparent conductive layers, two insulating layers, and a cover lens bonded with optical adhesive, then the module has complete protective and functional layers, but the module becomes overly thick with reduced light transmittance and increased cost

Engineering Contradiction:

Improveprotective and functional completenessVSAvoidmodule thickness

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

The patent combines the base plate and cover lens into a single integrated substrate structure, eliminating the need for separate layers and optical adhesive. This merging reduces the overall module thickness while maintaining the protective and functional properties through the integrated substrate design with embedded conductive patterns and insulated protrusions.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent extracts and eliminates the optical adhesive layer from the conventional multi-layer structure. By using an integrated substrate with built-in conductive patterns and insulated protrusions, the module achieves complete functionality without requiring external bonding agents, thereby reducing thickness and eliminating a source of optical interference.

Inventive Principle:

Principle #2Taking out (Extraction)

2Strength

If a conventional capacitance touch panel module uses optical adhesive to bond the cover lens, then the layers are securely bonded, but the module becomes more expensive and the adhesive cannot be recycled

Engineering Contradiction:

Improvebonding strengthVSAvoidmanufacturing cost and recyclability

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The patent removes the optical adhesive from the module structure entirely by designing an integrated substrate that provides both structural support and electrical functionality. The conductive patterns and insulated protrusions are embedded within the substrate itself, eliminating the need for external bonding agents and associated costs.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The substrate serves multiple functions simultaneously: it provides mechanical support, contains conductive patterns for touch sensing, includes insulated protrusions for electrical isolation, and acts as the protective cover. This multi-functionality eliminates the need for separate bonding layers and reduces overall manufacturing complexity and cost.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Object-affected harmful factors

If a capacitance touch panel module uses multiple separate layers including cover lens and optical adhesive, then the module has complete protective coverage, but the light transmittance is reduced

Engineering Contradiction:

Improveprotective coverageVSAvoidlight transmittance

Core Design Contradiction:

Object-affected harmful factorsVSIllumination intensity

Solution Approach 1:

The patent merges the protective cover and functional layers into a single integrated substrate structure. This integration reduces the number of optical interfaces and bonding layers that would otherwise scatter or absorb light, thereby improving light transmittance while maintaining complete protective coverage through the substrate's inherent structural integrity.

Inventive Principle:

Principle #5Merging (Combining)

4Reliability

If a conventional touch panel module uses five layers plus cover lens, then the module has complete functional layers, but the unit is overly thick with reduced quality

Engineering Contradiction:

Improvefunctional completenessVSAvoidnumber of layers

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent consolidates five separate layers (base plate, two conductive layers, two insulating layers) into a single integrated substrate with embedded conductive patterns and insulated protrusions. This merging maintains all necessary functional properties while dramatically reducing the number of discrete layers and overall module complexity.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS9204540B2Capacitance touch panel module and fabrication method thereof

Publication Date: 2015.12.01 RED OAK INNOVATIONS LTD

AI summary

A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covering one connecting portion, and forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.