Transparent LED Circuit Board With Thermal Domains for Heat Dissipation
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Solution Overview
Problem
Existing sun-sky-lighting systems face challenges in efficiently managing heat dissipation and maintaining optical alignment, particularly in configurations using transparent carrier boards with reduced heat conductivity.
Innovation Solution
The implementation of a modular light emitting module design featuring a transparent circuit board with thermally conductive and electrically conductive domains, along with a reflector panel and a secondary collimation layer, allows for efficient heat dissipation and maintains optical alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If transparent carrier boards with reduced heat conductivity are used, then optical transparency is improved, but heat dissipation capability deteriorates
Solution Approach 1:
The circuit board is divided into transparent domains and thermally conductive domains with distinct functions. Transparent domains allow light passage while thermally conductive domains handle heat dissipation, resolving the contradiction between optical transparency and heat dissipation capability.
Solution Approach 2:
Different regions of the circuit board are assigned different thermal and optical properties. The transparent domains maintain high optical transparency while thermally conductive domains provide enhanced heat dissipation pathways, allowing each region to optimize its local function.
2Temperature
If thermally conductive domains with sufficient area are implemented, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The thermally conductive domains serve dual purposes: they provide heat dissipation pathways and simultaneously function as mounting positions for LEDs. This multi-functionality reduces device complexity by combining thermal management and LED integration into a single structural element.
Solution Approach 2:
The thermal management function and LED mounting function are merged into the same thermally conductive domains. This integration simplifies the overall device structure by eliminating separate components for heat dissipation and LED attachment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables effective heat management and maintains optical alignment, ensuring the long-term operation and uniformity of light emission in sun-sky-lighting systems.
Implementation Method 1
a plurality of thermally conductive domains, each thermally conductive domain being thermally and electrically connected to at least one mounting position
Implementation Method 2
a plurality of electrically conductive domains, each electrically conductive domain being electrically connected to a couple of mounting positions
Implementation Method 3
a plurality of transparent domains, each transparent domain extending around one mounting position of the plurality of mounting positions
Data Source
AI summary
A circuit board for a light emitting module, comprises a plurality of mounting positions for LEDs, wherein the mounting positions are distributed in a regular two-dimensional pattern on a first surface side of the circuit board. The circuit board is characterized by (i) a plurality of transparent domains, each transparent domain extending around one mounting position of the plurality of mounting positions, and (ii) a plurality of thermally conductive domains, each thermally conductive domain being electrically and thermally connected to at least one mounting position. An average area of the electrically conductive domains is at least 2% of an average area of the transparent domains. Each thermally conductive domain of the plurality of thermally conductive domains comprises at least a portion, which extends as a two-dimensional area on a surface of the circuit board.