Molded Photosensitive Assembly for Uniform Dual-Camera Imaging
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Solution Overview
Problem
Current dual lens camera modules face challenges in ensuring uniform imaging quality due to uncontrollable dimension and position parameters, rigidity issues, and contamination from exposed circuit components, leading to deviations in image synthesis and increased module size.
Innovation Solution
A molded photosensitive assembly with a mold sealer that encloses electronic elements and lead wires, reducing exposure and contamination, and incorporates a reinforcing layer for enhanced rigidity and heat dissipation, while minimizing the module's size and thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If lens bases are individually coupled at the circuit board to connect with each other, then the dual lens camera module can be assembled, but the dimension and position parameters become uncontrollable leading to imaging quality deviation
Solution Approach 1:
The patent merges the two separately coupled lens bases into a single integrated lens base structure. This integration ensures that the dimension and position parameters are controlled by a single manufacturing process rather than two separate coupling operations, thereby maintaining manufacturing precision while still allowing for assembly.
2Ease of manufacture
If the circuit board is used to connect lens bases, then electrical connection is achieved, but the rigidity of the overall structure is weak and easy to deform
Solution Approach 1:
The patent employs a composite structure where a rigid support frame made of high-strength material is combined with the circuit board. The support frame provides the necessary rigidity and structural strength, while the circuit board maintains its electrical connection function. This composite approach resolves the contradiction by allowing both electrical connectivity and structural rigidity to coexist.
3Reliability
If lens motor assemblies are wrapped within supporting frame with adhesive, then components are secured, but the overall size of the module increases
Solution Approach 1:
The patent merges the supporting frame structure with the lens base integration, creating a unified structural element that secures the lens motor assemblies without requiring additional adhesive layers or separate wrapping components. This integration reduces the overall module size while maintaining the reliability of component securing through the integrated structural design.
4Ease of manufacture
If circuit protrusion and gold wire are exposed from the circuit board, then electrical connection is established, but dust accumulation affects photosensitive chip and reduces image quality
Solution Approach 1:
The patent extracts the electrical connection elements (circuit protrusion and gold wire) from the exposed surface by routing them through enclosed channels within the integrated lens base structure. This extraction eliminates the dust accumulation problem while maintaining electrical connectivity, as the connections are established through protected internal pathways rather than exposed external elements.
Data Source
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AI summary
An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.