Surface-Mount Optical Module Alignment for Low-Loss Board Mounting
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Solution Overview
Problem
Conventional optical modules face issues such as high-frequency signal loss, impedance mismatch, and power consumption due to long distances between optical elements and electronic devices, and require a method to minimize these while allowing for easy maintenance in a confined space.
Innovation Solution
A surface mount type optical module with a compact attachment/detachment apparatus using a gripper, aligning part, and laser part for non-contact soldering, enabling automatic alignment and attachment/detachment in a narrowly confined space.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If pluggable optical modules are used with external front panel fastening, then ease of installation is improved, but distance between optical element and electronic device increases causing signal loss
Solution Approach 1:
The patent transitions from external front panel mounting (one dimension) to on-board optics mounting directly on the system board (another dimension), thereby reducing the distance between optical elements and electronic devices while maintaining ease of installation through standardized interfaces
2Loss of energy
If on-board optics is adopted to minimize distance, then signal loss is reduced, but maintenance difficulty increases due to confined working space
Solution Approach 1:
The patent segments the optical module into a replaceable unit that can be independently attached and detached from the system board, allowing maintenance personnel to access and replace the optical module even in confined spaces without affecting other components
Solution Approach 2:
The patent employs dynamic attachment and detachment mechanisms that allow the optical module to be easily installed and removed despite the on-board mounting configuration, resolving the maintenance difficulty through movable and adjustable components
3Ease of operation
If socket scheme is used for on-board optics, then attachment is simplified, but impedance mismatch and parasitic components increase causing high-frequency signal loss
Solution Approach 1:
The patent extracts the socket intermediate layer from the connection path between the optical module and system board, establishing direct contact between electrodes to eliminate impedance mismatch and parasitic components while maintaining simplified attachment through direct mounting
4Loss of energy
If Co-Packaged Optics or Near Package Optics are adopted, then signal loss is minimized, but attachment/detachment complexity increases in confined space
Solution Approach 1:
The patent designs a universal attachment/detachment apparatus that integrates multiple functions (positioning, alignment, bonding, and detachment) into a single device, enabling all operations to be performed through one standardized interface despite the confined working space
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Minimizes high-frequency signal loss and power consumption by reducing the distance between optical and electronic devices, while facilitating easy and non-destructive attachment and detachment in a confined space.
Implementation Method 1
a laser part which irradiates a laser for non-contact bonding between the optical module and the board
Data Source
AI summary
The present disclosure is to provide a shape of a surface mount type optical module to be mounted on a surface of a system board or package submount, and is to provide a compact and lightweight optical module attachment/detachment apparatus that performs the mounting (attachment) and separation of the optical module in a confined space by automatically performing optical module loading/unloading, optical module alignment, and laser soldering to facilitate attachment and detachment of the optical module. The attachment/detachment apparatus includes a body frame; a fixing part for fixing the body frame to the board; a gripper for gripping the optical module; an aligning part for aligning the position of the optical module with respect to the board; and a laser part which irradiates a laser for non-contact bonding between the optical module and the board.