LED Lamp Panel Reflective Layer Layout for Die Bonding and Light Output
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Solution Overview
Problem
Existing LED lamp panels face challenges such as poor die bonding, low lighting effect, and high manufacturing costs due to issues like thermal expansion mismatch between substrates and encapsulant layers, limited reflectivity of white ink, and inadequate light distribution.
Innovation Solution
The proposed LED lamp panel design includes a substrate with a circuit composite layer, a first reflective layer with window structures, and a second reflective layer filled in the accommodating areas between the LED chip and the first reflective layer. This design improves die bonding, enhances lighting effect, and reduces manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a window-forming treatment of white ink is carried out on the glass substrate to expose the bonding pad, then the die bonding is enabled, but the lighting effect is greatly affected due to light loss through the glass and limited reflectivity of white ink
Solution Approach 1:
The patent changes the optical parameters of the substrate by applying a reflective coating layer with high reflectivity (greater than 90%) in the visible light range. This replaces the conventional white ink with a material that has superior reflective properties, thereby improving the lighting effect while maintaining the window-forming structure necessary for die bonding.
Solution Approach 2:
The patent uses a composite structure consisting of the glass substrate combined with a reflective coating layer. This composite material approach allows the substrate to maintain its mechanical properties and window-forming capability while the reflective coating layer provides enhanced light reflection to improve the overall lighting effect.
2Illumination intensity
If the window size is increased to reduce light loss, then more light reaches the bonding pad, but the glass substrate is exposed and light is lost through the glass
Solution Approach 1:
The patent converts the harmful effect of light loss through the glass substrate into a beneficial effect by applying a reflective coating layer. This coating layer reflects the light that would otherwise be lost back toward the bonding pad, turning the glass's transparency from a disadvantage into an opportunity for enhanced light management.
3Ease of manufacture
If there is a large thermal expansion mismatch between the substrate and encapsulant layer, then the assembly is easier to manufacture, but the substrate warps and delamination occurs
Solution Approach 1:
The patent changes the thermal expansion parameter of the encapsulant layer by selecting materials with thermal expansion coefficients closer to that of the glass substrate. This reduces the thermal expansion mismatch, preventing substrate warping and delamination while maintaining manufacturability.
4Illumination intensity
If the reflectivity of white ink is increased to improve lighting effect, then the backlight brightness is enhanced, but the manufacturing cost increases
Solution Approach 1:
The patent employs a cost-effective reflective coating layer that can be applied using conventional coating techniques. The coating material is selected to provide high reflectivity at a reasonable cost, balancing performance improvement with manufacturing cost considerations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved die bonding process, combined with the enhanced reflective layers, results in increased lighting effect and process yield while maintaining a low manufacturing cost. The design effectively addresses the thermal expansion mismatch and improves light distribution.
Implementation Method 1
a first reflective layer is disposed on the circuit composite layer... a second reflective layer filled in the accommodating area
Data Source
AI summary
An LED lamp panel, which comprises a substrate that is provided with a circuit layer, and the circuit layer is provided with bonding pads for connecting with a plurality of LED chips; the circuit layer is provided with a first reflective layer, and the first reflective layer is provided with a plurality of window structures, which are disposed in an array, and at least one pair of bonding pads for connecting with the LED chips is distributed in each of the window structures; the LED lamp panel further comprises a second reflective layer filled between the first reflective layer and the LED chips, and the reflectivity of the second reflective layer is greater than that of the first reflective layer. The LED lamp panel provided by the present disclosure is beneficial for die bonding and has a high lighting effect, an improved process yield, and a low manufacturing cost.