Optical Package Cap Assembly to Separate Solder and Adhesive
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Solution Overview
Problem
The existing methods for connecting a cap to a support substrate in optical packages often result in electrical malfunctions due to the mixing of soldering material and adhesive, which can lead to short circuits, and require a larger substrate surface area to prevent mixing.
Innovation Solution
The implementation of assembly means that provide a separation between the soldering material and the adhesive, either by distance or through structural modifications in the cap and substrate, such as through holes or trenches, to prevent mixing and allow for a controlled electrical connection using soldering material like solder wire or bumps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering material is deposited far from the adhesive to avoid mixing, then electrical malfunction is prevented, but substrate surface area increases
Solution Approach 1:
The substrate surface is segmented into distinct functional zones: a first zone for adhesive deposition and a second zone for soldering material deposition. These zones are spatially separated to prevent mixing while maintaining electrical connectivity. The segmentation allows each material to be placed optimally without interfering with the other, resolving the contradiction between reliability and surface area usage.
Solution Approach 2:
Different regions of the substrate are assigned different local qualities or functions. The first zone is optimized for adhesive bonding with appropriate surface properties, while the second zone is optimized for soldering with suitable electrical and thermal characteristics. This local differentiation enables effective use of substrate area while ensuring reliable electrical connections without mixing of materials.
2Reliability
If soldering material and adhesive are kept separate, then electrical malfunctions are prevented, but assembly complexity increases
Solution Approach 1:
The assembly structure is segmented into distinct functional zones on the substrate, with the first zone dedicated to adhesive and the second zone dedicated to soldering material. This spatial segmentation simplifies the assembly process by providing clear guidelines for material placement, reducing the need for complex assembly procedures while maintaining reliability through prevented mixing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables reliable electrical connection between the cap and substrate without the risk of malfunctions and reduces the required substrate surface area, ensuring effective separation of soldering material and adhesive to prevent mixing.
Implementation Method 1
a cap fixed to the support substrate by adhesive
Implementation Method 2
second electrical contacts connected to the first electrical contacts by a soldering material
Data Source
AI summary
An optical package comprising a support substrate including first electrical contacts, a cap fixed to the support substrate by adhesive and comprising second electrical contacts connected to the first electrical contacts by a soldering material, a separation structure disposed between the soldering material and the adhesive