Epoxy Via Frame Structure for Short Optical Transceiver Interconnects
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Solution Overview
Problem
In high-data-rate optical transceivers, there is a need for a packaging solution that accommodates electro-optical components and provides short electrical interconnects to preserve signal integrity.
Innovation Solution
A via frame is provided, comprising a sheet of epoxy mold compound with a plurality of holes filled with conductive elements, such as metal-filled epoxy or copper-filled epoxy with silver-coated copper particles, and conductive bumps on the surfaces for electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging solutions are used, then component accommodation is achieved, but electrical interconnect length increases causing signal integrity degradation
Solution Approach 1:
The packaging structure is segmented into multiple functional layers: the via frame substrate with embedded conductive vias, electro-optical components mounted on the frame, and conductive bumps providing interconnects. This segmentation allows each component to be positioned optimally, minimizing interconnect length while maintaining signal integrity.
Solution Approach 2:
The via frame acts as an intermediary structure between electro-optical components and the packaging substrate. It provides a platform with pre-formed conductive vias and bumps that serve as intermediate connection points, reducing the need for long trace interconnects and improving signal integrity.
2Reliability
If short electrical interconnects are implemented, then signal integrity is preserved, but packaging complexity increases
Solution Approach 1:
The via frame serves multiple functions simultaneously: it provides mechanical support for electro-optical components, establishes electrical connections through embedded conductive vias, provides mounting positions for conductive bumps, and acts as a structural platform. This multi-functionality reduces overall packaging complexity despite achieving short interconnects.
Solution Approach 2:
The via frame merges several functions into a single integrated structure: substrate support, conductive interconnect formation, component mounting platform, and bump attachment base. By combining these functions, the packaging complexity is managed while maintaining short electrical interconnects for signal integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The via frame effectively provides short electrical interconnects between electro-optical components, preserving signal integrity and supporting high-data-rate operations in optical transceivers.
Implementation Method 1
a plurality of conductive elements, each extending through a respective one of the holes... each of the conductive elements is a metal-filled epoxy element... each of the conductive elements includes copper-filled epoxy... the copper-filled epoxy includes a plurality of silver-coated copper particles in a cured epoxy matrix
Data Source
AI summary
A via frame. In some embodiments, the via frame includes: a sheet of epoxy mold compound, having a plurality of holes each extending through the sheet of epoxy mold compound, and a plurality of conductive elements, each extending through a respective one of the holes.