Multilayer Film Assembly With Air Gap for Injection-Molded Electronics
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Solution Overview
Problem
Conventional multilayer structures in vehicles face challenges with increased failure rates due to direct exposure of LEDs and circuit traces to injection molding pressure, requiring large installation spaces and leading to high disposal costs when individual components fail.
Innovation Solution
A multilayer structure with air gaps between films and integrated LEDs and conductive traces on separate films, protected by injection-molded layers, allowing separate testing and assembly of components to reduce exposure to injection pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If LEDs and circuit traces are directly embedded in the injection-molded structure, then integration and space utilization are improved, but failure rate increases due to exposure to injection molding pressure
Solution Approach 1:
The patent divides the structure into multiple films (first film with LEDs, second film with touch sensors) separated by an air gap, allowing each component to be processed independently and reducing stress concentration on any single component during injection molding
Solution Approach 2:
The air gap acts as an intermediary between the injection-molded layers, preventing direct transmission of injection pressure to the LEDs and circuit traces while still allowing structural integration
2Adaptability or versatility
If conventional PCBs with LEDs and light channels are used, then functional integration is achieved, but installation space requirement increases
Solution Approach 1:
The patent merges multiple functions (light emission, touch sensing, structural support) into a single multilayer film assembly, eliminating the need for separate PCBs, LED mounts, and light channel structures, thereby reducing overall installation space
Solution Approach 2:
The patent transitions from a planar PCB layout to a three-dimensional multilayer film structure with air gaps and stacked films, enabling vertical integration that reduces the footprint area required for installation
3Ease of repair
If individual LED components fail, then component replacement is needed, but disposal cost increases as entire component must be disposed of
Solution Approach 1:
By segmenting the structure into separable films with an air gap, the patent enables individual film replacement (e.g., only the LED film or only the touch sensor film) rather than requiring disposal of the entire assembly, reducing material waste and disposal costs
Data Source
Figure 1
AI summary
An electronically functional multilayer structure is described, comprising a first film (1) on which first electrical and/or electronic components (2) are arranged on a first film surface, and a second film (3) on which second electrical and/or electronic components (4) are arranged on a first film surface. The two films (1, 3) are arranged such that their sides with their respective first film surfaces face each other, with a gap (5) between the two films (1, 3) in the region of the first and second electrical and/or electronic components (2, 4).