Substrate Via Layout for Warpage-Resistant Electronic Packaging
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Solution Overview
Problem
Existing electronic device packaging structures face challenges in preventing warping due to uneven stress, which affects the yield of electronic components and does not fully meet electrical and structural requirements.
Innovation Solution
The introduction of a dummy via pattern in the substrate structure, which is electrically insulated from the circuit structure, helps to balance stress and prevent warping, while maintaining the electrical integrity of the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If conventional packaging structures are used, then manufacturing is simpler, but the substrate warps due to uneven stress
Solution Approach 1:
The packaging structure is segmented into functional regions: active areas with conductive vias for electrical connections and dummy via patterns in inactive areas for stress compensation. This segmentation allows different regions to serve different purposes while working together to prevent substrate warping.
Solution Approach 2:
The dummy via patterns modify the physical parameters of the substrate structure by adding via holes in non-conductive regions. This changes the stress distribution parameters across the substrate, balancing the uneven stress that would otherwise cause warping.
2Stability of the object's composition
If dummy via pattern is added to balance stress, then substrate stability improves, but manufacturing complexity increases
Solution Approach 1:
The formation of dummy via patterns is merged with the existing via formation process. Both conductive and dummy vias are created using the same manufacturing steps, integrating the stress compensation feature into the standard fabrication workflow without requiring separate complex processes.
3Stability of the object's composition
If dummy via pattern is electrically connected to circuit structure, then stress balance improves, but electrical insulation is compromised
Solution Approach 1:
Different regions of the substrate have different properties: active areas contain conductive vias with electrical connectivity, while inactive areas contain dummy via patterns that are electrically insulated. This local differentiation allows stress balance across the entire substrate while maintaining electrical insulation where required.
Data Source
AI summary
An electronic device is provided. The electronic device includes a substrate structure, a control unit, a first circuit structure, and an electronic unit. The substrate structure has a conductive via pattern and a dummy via pattern. The control unit is electrically connected to the conductive via pattern. The first circuit structure is electrically connected to the conductive via pattern. The electronic unit is electrically connected to the control unit through the first circuit structure. The dummy via pattern is electrically insulated from the first circuit structure.