Stepped Circuit Board Package for Compact Image Sensor Integration
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Solution Overview
Problem
Existing semiconductor packages face challenges in miniaturization and integration of image sensors due to structural limitations, which hinder the development of compact and multifunctional electronic devices.
Innovation Solution
A semiconductor package design featuring a circuit board with a recessed region and a transparent substrate wider than the circuit board, where an image sensor chip is mounted, with a connection terminal and gap-fill member to enhance electrical connectivity and protect the chip, allowing for reduced size and improved light transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a traditional semiconductor package design is used, then the structure is simple to manufacture, but the package size cannot be minimized and thermal expansion damage occurs
Solution Approach 1:
The circuit board is divided into multiple portions (first portion, second portion, third portion) with different heights, creating a stepped structure that accommodates multiple components at different levels. This segmentation allows for compact integration while maintaining manufacturing feasibility through standard PCB fabrication processes.
Solution Approach 2:
The invention transitions from a two-dimensional planar layout to a three-dimensional stepped structure by varying the height of different circuit board portions. This dimensional change enables vertical stacking of components and reduces the overall package footprint without significantly increasing manufacturing complexity.
2Reliability
If the image sensor chip is exposed without protection, then light transfer is efficient, but the chip is vulnerable to thermal expansion damage and physical damage
Solution Approach 1:
The transparent substrate is positioned to cover only specific portions of the image sensor chip (the regions above the first and third portions of the circuit board), while leaving the active array region exposed. This localized protection approach shields vulnerable areas from thermal and physical damage while maintaining optimal light transfer to the photosensitive elements.
Solution Approach 2:
The transparent substrate acts as an intermediary protective layer that filters and transmits light while providing mechanical and thermal protection. It serves as a mediator between the external environment and the sensitive image sensor chip, allowing light to pass through while blocking harmful thermal and physical effects.
3Reliability
If connection terminals are left exposed, then electrical connectivity is direct, but the terminals are vulnerable to damage and contamination
Solution Approach 1:
The gap-fill member serves multiple functions simultaneously: it protects the connection terminals from damage and contamination, fills voids in the package structure, and provides mechanical support. By combining these functions into a single component, the overall device complexity is minimized while achieving comprehensive terminal protection.
4Stability of the object's composition
If a recessed region is created in the circuit board, then component integration is optimized and thermal damage is reduced, but the manufacturing process becomes more complex
Solution Approach 1:
The circuit board is segmented into portions of different heights, creating recessed regions that provide thermal buffering and mechanical support. This segmentation allows heat to be distributed across different levels, preventing concentrated thermal stress on sensitive components while maintaining a relatively simple manufacturing process using standard multi-layer PCB techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables miniaturization of semiconductor packages while maintaining electrical connectivity and protecting the image sensor chip, facilitating the development of compact and multifunctional electronic devices.
Implementation Method 1
An image sensor chip is mounted on the circuit board. The image sensor chip includes an active array region facing the transparent substrate.
Data Source
AI summary
A semiconductor package that includes a circuit board having an opening therein. The circuit board includes a first portion, and a second portion disposed below the first portion. The first portion protrudes further in a horizontal direction towards the opening than the second portion. A transparent substrate is disposed on the circuit board. An image sensor chip is mounted on the circuit board. The image sensor chip includes an active array region facing the transparent substrate. A connection terminal directly contacts a lower surface of the first portion of the circuit board and an upper surface of the image sensor chip. A gap-fill member covers the connection terminal and covers a portion of an upper surface of the image sensor chip and at least a portion of a lateral side surface of the image sensor chip. The transparent substrate has a greater horizontal width than the circuit board.